International Business Machines Corporation

Katie L Pizzolato

Arden Lot Moore

K Paul Muller

Gary Franklin Goth

Randall G Kemink

Scott J Hadderman

Benjamin W Mashak

Andrew H Vogel

Timothy R Marchini

Carrie Sitten Westmark

John G Torok

Eric Alan Eckberg

David L Edwards

Scott Alan Shurson

Amilcar R Arvelo

Steven John Ahladas

Jason R Eagle

Robert Philip Makowicki

David Charles Olson

Gary N Goth

A technique for calibrating a fluid flow sensor includes generating fluid flow at a first speed. A first temperature of the fluid flow is determined using a first temperature sensor that is positioned upstream of the fluid flow sensor. A first power is supplied to a main heater of the fluid flow sensor to adjust a second temperature of a first plate of the fluid flow sensor to be substantially equal to the first temperature, A second power is supplied to a guard heater of the fluid flow sensor to adjust a third temperature of a second plate of the fluid flow sensor to be substantially equal to a fourth temperature of the first plate. The first and second plates are separated by a spacer and the first speed and the third temperature provide a calibration point on a calibration curve for the fluid flow sensor.

Techniques for calibrating an air-flow sensor for adapter slots in a data processing system

An air-flow sensor is configured to be positioned in an air-flow and attached to a surface in a manner that allows air to flow over an extremity of the sensor. The air-flow sensor includes a base plate, a first heater, a first temperature sensor, a spacer, a second heater, a second temperature sensor, and a cap. The base plate is configured to be the coupled to the surface. The first heater is positioned on the base plate and is configured to heat the base plate. The first temperature sensor is positioned to measure a first temperature of the first heater. The spacer is positioned on the first heater and the second heater is positioned on the spacer. The second temperature sensor is positioned to measure a second temperature of the second heater. The cap is positioned on the second heater, which is configured to heat the cap.

Air-flow sensor for adapter slots in a data processing system

A modular refrigeration unit (MRU) health monitor includes a log data input configured to receive log data from an MRU, the log data comprising a plurality of datapoints, each of the plurality of datapoints comprising a position of a control valve of the MRU and a corresponding time; and MRU health monitoring logic configured to determine a plurality of MRU parameters from log data received on the log data input; determine a plurality of MRU health flags based on the MRU parameters; add the plurality of MRU health flags to determine an MRU health score; determine whether the MRU health score is higher than a replacement threshold; and indicate replacement of the MRU in the event the MRU health score is higher than the replacement threshold.

Modular refrigeration unit health monitoring

A method for modular refrigeration unit (MRU) health monitoring includes receiving log data on a log data input from the MRU by a MRU health monitor, the log data comprising a plurality of datapoints, each of the plurality of datapoints comprising a position of a control valve of the MRU and a corresponding time; determining by the MRU health monitor a plurality of MRU parameters from the log data; determining a plurality of MRU health flags based on the MRU parameters; adding the plurality of MRU health flags to determine an MRU health score; determining whether the MRU health score is higher than a replacement threshold; and indicating replacement of the MRU in the event the MRU health score is higher than the replacement threshold.

An approach is provided in which a cooling manager detects a failed fan included in an electronic enclosure. The electronic enclosure includes multiple fans that each cool different component areas in the electronic enclosure. The cooling manager selects an airflow compensator that corresponds to a functioning fan included in the electronic enclosure, which includes a fixed perforated member and a movable perforated member. In turn, the cooling manager adjusts the selected airflow compensator to redirect a portion of airflow generated by the functioning fan to the component area corresponding to the failed fan.

Dynamic compensation of airflow in electronics enclosures with failed fans

A method, system, and apparatus for cooling one or more devices through use of a cooling plate. An example system includes multiple heat generating devices coupled to a cooling plate, each through an individual thermal interface unit. The thermal interface unit includes a compressible solid pad with at least one surface having a plurality of projections carrying a flowable material. The thermal interface units are pressed between the heat generating devices and the cooling plate so that the flowable material is completely enclosed.

Customized thermal interface to optimize mechanical loading and thermal conductivity characteristics

A system to remove heat from an in-line memory module and/or circuit board may include a cold-rail to engage each end of an in-line memory module adjacent to where the in-line memory module is attachable to a circuit board, the cold-rail to remove heat from the in-line memory module. The system may also include a cold-plate connected to the cold-rail with the circuit board between the cold-plate and the cold-rail, the cold-plate to remove heat from the circuit board.

In-line memory and circuit board cooling system

A system to aid in cooling an in-line memory module may include a thermal interface material adjacent the in-line memory module. The system may also include a heat spreader adjacent the thermal interface material. The system may further include a cold-plate adjacent the heat spreader, the cold-plate, heat spreader, and thermal interface material to aid in cooling the in-line memory module.

In-line memory module cooling system

Automated control is provided of rotational velocity of an air-moving device cooling an electronics subsystem of an electronics rack. The automated control includes: automatically responding to a failure event associated with the electronics subsystem of the rack by setting rotational velocity of the air-moving device to a first upper limit (RPM) above a normal operating limit; sensing motor temperature of a motor of the air-moving device; automatically increasing rotational velocity of the air-moving device to a second upper limit (RPM) if the sensed motor temperature is below a first predefined temperature threshold (T), wherein RPM&#x3e;RPM; maintaining rotational velocity of the air-moving device at the second upper limit while the sensed motor temperature is below a second predefined temperature threshold (T), wherein T&#x3e;T; and returning to normal operating rotational velocity of the air-moving device subsequent to servicing of the electronics rack responsive to the event.

Growing community of inventors

Austin, TX, United States of America

Katie L Pizzolato