Xerox Corporation

Kathryn A Wallace

Joseph R Weber

Robert M White

Robert P Altavela

Michael J Duggan

J Stephen Kittelberger

Henry T Mastalski

Steven Donald Bush

Lawrence H Herko

Leela Ganguly

John L Ferrante

A process including providing a hollow imaging drum having a first end, a second end, an outside surface, an inside surface and coating material on both the inside surface and the outside surface at at least the first end, simultaneously contacting the coating material on both the inside surface and the outside surface at the first end of the drum with resilient foam material, flowing liquid solvent for the coating material to the foam material where the foam material contacts the first end of the drum, the foam material being insoluble in the flowing solvent, producing relative movement between the foam material and the drum to simultaneously wipe both the inside surface and the outside surface of the first end of the drum with the foam material and solvent material and simultaneously remove coating material from the inside surface and the outside surface of the first end of the drum, and flowing the solvent away from the drum to carry away coating material removed from the inside surface and the outside surface of the first end of the drum.

Process for removing a strip of coating material

A method and apparatus for determining the level of roughness in a paper or other substrate to be processed in a machine, and for correspondingly adjusting the machine parameters that are affected by the different levels of substrate roughness, before the substrate is processed through the machine.

Method and apparatus for detecting substrate roughness and controlling

A method of fabricating thermal ink jet printheads comprises aligning and bonding a pair of silicon wafers together, which have, on opposing confronting surface thereof, a plurality of sets of linear arrays of heating elements and associated driver circuitry on one wafer surface and a plurality of sets of parallel grooves and a communicating reservoir for each set of grooves. The grooves and reservoirs are filled with a filler material which is solid or gels at room temperature and liquid at higher temperatures. The bonded pair of wafers are severed into a plurality of individual printhead sby dicing processes conducted at room temperature. One of the dicing processes cuts the grooves in a direction perpendicular thereto in order to form concurrently the nozzle face and nozzles. The solid filler material supports fragile edges of the wafers and prevents entry of dicing debris and other contaminants. The printheads are subjected to heat, spinning, and high pressure water spray to remove the filler material.

Method of reducing chipping and contamination of reservoirs and channels

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Canandaigua, NY, United States of America

Kathryn A Wallace