Tektronix, Inc.

Kathleen F Ullom

Ira G Pollock

James E Spinar

Leonard A Roland

Milton D Klaudt

Roy O Mitchell

The manufacturing method of a probe with printed tip consists of a substrate having a plurality of probe tips connected to its end edge, a plurality of test paths, each connected to one of the probe tips and extending along the substrate, and at least one of the test paths including an electrical component adjacent to the test path's probe tip. The electrical component may be a resistor. The probe tips may have a width equal to the thickness of the substrate. The probe tips may consist of a plurality of probe tip layers. The invention also includes a method of probing signals transmitted over target transmission lines on a target board. The disclosure also includes a method of manufacturing the claimed invention.

Method of manufacturing probe with printed tip

The probe with printed tip consists of a substrate having a plurality of probe tips connected to its end edge, a plurality of test paths, each connected to one of the probe tips and extending along the substrate, and at least one of the test paths including an electrical component adjacent to the test path's probe tip. The electrical component may be a resistor. The probe tips may have a width equal to the thickness of the substrate. The probe tips may consist of a plurality of probe tip layers. The invention also includes a method of probing signals transmitted over target transmission lines on a target board. The disclosure also includes a method of manufacturing the claimed invention.

Probe with printed tip

A cathode drive circuit couples a video drive signal from a cathode output amplifier to the cathode of a cathode ray tube along a first matched transmission line. Any signal energy not absorbed by the cathode is coupled along a second matched transmission line to a power dissipating load. The use of matched transmission lines avoids reflections in the system and eliminates attendant signal degradation. The power dissipating load can be located at any distance remote from both the cathode output amplifier and the cathode so as to minimize heat dissipation problems.

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West Linn, OR, United States of America

Kathleen F Ullom