International Business Machines Corporation

Kathleen Conlon Hinge

John Ulrich Knickerbocker

Gareth Geoffrey Hougham

Jon Alfred Casey

Stephen L Buchwalter

Sung Kwon Kang

Claudius Feger

Leena Paivikki Buchwalter

Matteo Flotta

Anurag Jain

Paul William Coteus

Michael A Gaynes

Jeffrey Donald Gelorme

Brian Samuel Beaman

Frank Robert Libsch

Shawn Anthony Hall

Theron Lee Lewis

Amanda E E Mikhail

John S Corbin

Jeffrey D Gelmore

LGA connectors are fabricated with buttons or spring contacts preformed to different heights to accommodate the initial topography of a typical module or PCB of a particular product type. This is accomplished during fabrication by measuring topographies of mating surfaces of a first electronic device and of a second electronic device; fabricating interposer contacts to form opposing non-planar sides having respective inverse topographies for contacting the mating surfaces; and sandwiching the interposer between the first and second electronic devices with the opposing sides in contact with respective mating surfaces.

Method of making a land-grid-array (LGA) interposer

The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or protective member of an electronic component.

Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formation

Apparatus and methods are provided for constructing balanced semiconductor chip package structures that minimize bowing, in-plane strain and/or other thermally induced mechanical strains that may arise during thermal cycling, to thus prevent structural damage to chip package structures.

Apparatus and methods for constructing balanced chip packages to reduce thermally induced mechanical strain

Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation

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Tarrytown, NY, United States of America

Kathleen Conlon Hinge