Intel Corporation

Kathiravan D

Prakash Kurma Raju

Prasanna Pichumani

Bijendra Singh

Hari Shanker Thakur

Ritu Bawa

Mark Charles Carbone

Juha Paavola

Vivek Paranjape

Gustavo Fricke

Christopher M Moore

Babu Triplicane Gopikrishnan

Jeff Ku

Gavin Sung

Daniel J Ragland

Arnab Sen

Justin Michael Huttula

Hua Yang

Mikko Antero Makinen

Kannan G Raja

Gokul V Subramaniam

Lance Lin

Jason Y Jiang

Baomin Liu

Xiyong Tian

Jia Yan Go

Columbia Mishra

Ruander Cardenas

Raghavendra Doddi

Twan Sing Loo

Evan Piotr Kuklinski

Gerry Juan

Chin Kung Goh

Javed Shaikh

Ravishankar Srikanth

Doddi Raghavendra

Deepak Sekar

Triplicane Gopikrishnan Babu

Nehakausar Shaikh Ramjan Pinjari

Chun-Ting Liu

Shih Wei Nien

George Baoci Sun

Penchala Pratap Binni Boyina

Mikko Makinen

Nehakausar Pinjari

Sammi Wy Liu

Khal Ern See

Arunpandi R

Synthetic jet systems and related methods are disclosed. An electronic device includes a heat spreader including a first surface and a second surface opposite the first surface. A synthetic jet is coupled to the first surface of the heat spreader. The synthetic jet and the heat spreader define a fluid flow passageway having an inlet, a first outlet and a second outlet. The synthetic jet and the heat spreader to bifurcate airflow from the inlet such that the first outlet is to exhaust airflow from the passageway adjacent the first surface of the heat spreader and the second outlet is to exhaust airflow from the passageway adjacent the second surface of the heat spreader.

Thermal management systems for electronic devices and related methods

An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

Cooling systems, cooling structures and electronic devices and methods for manufacturing or operating cooling systems, cooling structures and electronic devices

Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, one or more heat sources over the substrate, one or more heat pipes thermally coupled to the one or more heat sources, a heat spreader coupled to the one or more heat pipes, where the heat spreader is in-plane with the heat pipe, and one or more loading mechanisms coupled to at least a portion of the one or more heat pipes and to the substrate. The one or more loading mechanisms are in-plane with the spreader and the one or more heat pipes.

Heat pipe with in-plane heat spreader and loading mechanism

Particular embodiments described herein provide for an electronic device that can be configured to include a vapor chamber and means of attachment for the vapor chamber. The vapor chamber can include one or more columns, where at least a portion of the columns include fiber braids and one or more wicks. At least one of the wicks can also include the fiber braids. The columns can be braised to a top plate or a bottom plate of the vapor chamber. The vapor chamber can be secured over a heat source using a vapor chamber securing means that can include spring arms. The spring arms can bend, flex, rotate, etc. to absorb some of the force when vapor chamber is secured over the heat source.

Vapor chamber and means of attachment

A convertible mobile compute device comprises a lid, a base, and a hinge assembly coupled to the lid and the base. The hinge assembly includes a lid hinge bracket secured to the lid and configured to rotate about a lid hinge axis. The hinge assembly also includes a base hinge bracket secured to the base and configured to rotate about a base hinge axis. The lid hinge axis is offset from a centerline axis defined by the lid, and the base hinge axis is offset from a centerline axis defined by the base. As described herein, the offsetting of the hinge axes provides for a smaller a lid-to-base gap when the convertible mobile compute device is positioned in a closed mode relative to when the convertible mobile compute device is positioned in a tablet mode.

Offset hinge assembly for mobile compute devices

Particular embodiments described herein provide for an electronic device that can be configured to include a first housing, a second housing, a hinge that rotatably couples the first housing to the second housing, and a flexible heat spreader that extends from the second housing, through the hinge, and to the first housing. The hinge can accommodate deformations in the flexible heat spreader when the first housing is rotated relative to the second housing.

Flexible hinge to accommodate a flexible heat spreader

Convertible electronic device

Growing community of inventors

Bengaluru, India

Kathiravan D