Volterra Semiconductor Corporation

Katherine Nickel, Legal Representative

David B Lidsky

Seth Marshall Kahn

Charles Nickel

A detection circuit and one or more wires or circuit traces are included in a die. The combination is used to detect mechanical failure of the substrate, e.g. silicon after singulation of the dice from the wafer. Failures may be detected at different regions or planes within the die, and the tests may be performed during operation of the packaged die and integrated circuit, even after installation and during operation of a larger electronic device in which it is incorporated. This is especially useful for chip scale packages, but may be utilized in any type of IC package.

Growing community of inventors

Williamsburg, MA, United States of America

Katherine Nickel, Legal Representative