Lam Research Corporation

Katgenahalli Y Ramanujam

John Boyd

Xuyen Pham

Travis R Taylor

Tony Luong

Sridharan Srivatsan

Christian DiPietro

Stephen C Jew

Philip Ngoon

A belt wiper that can be used in a linear belt-type chemical mechanical planarization (CMP) system to maintain a belt pad is provided. The belt wiper mitigates disturbances within a detection region important to a belt pad steering system. Also, the belt wiper mitigates the obscuring of optical components important to operation of an endpoint detection system. Thus, the belt wiper, by wiping the underside of the belt pad will preserve the functionality of both the belt pad steering system and the endpoint detection system.

Belt wiper for a chemical mechanical planarization system

An interlocking polishing belt apparatus is disclosed. The interlocking polishing belt apparatus includes an interlocking belt, which includes a plurality of studs each having an upper stud end and a lower stud end. In addition, the interlocking polishing belt apparatus includes a polishing belt that is in contact with the interlocking belt. The polishing belt has a plurality of polishing belt stud holes, each configured to interlock with an upper stud end.

Interlocking chemical mechanical polishing system

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Fremont, CA, United States of America

Katgenahalli Y Ramanujam