Dow Corning Toray Company, Ltd.

Dow Corning Corporation

Dow Toray Co., Ltd.

Dow Silicones Corporation

Dupont Specialty Materials Korea Ltd.

Dupont Toray Specialty Materials Kabushiki Kaisha

Kasumi Takeuchi

Makoto Yoshitake

Yoshitsugu Morita

Tomohiro Iimura

Michitaka Suto

Koji Nakanishi

Kazuhiro Nishijima

Takashi Sagawa

Masashi Murakami

Haruhiko Furukawa

Randall Gene Schmidt

Eric S Moyer

Craig Rollin Yeakle

Sheng Wang

Hideki Kobayashi

Takuya Ogawa

Akihiko Kobayashi

Masaaki Amako

Shedric Oneal Glover

Hisataka Nakashima

Shunya Takeuchi

Michael L Bradford

Shengqing Xu

Michael Robert Reiter

Mary Kay Tomalia

Sawako Horie

Toshinori Watanabe

Hyunji Kang

Andrew MacMillan

Mayumi Matsuzaki

M Dow Corning Toray Co Ltd Yoshitake

T Dow Corning Toray Co Ltd Watanabe

O Shedric Glover

Makoto; Yoshitake

Curable silicone compositions, encapsulants including the same, and optical semiconductor devices including the encapsulants are provided herein. In an embodiment, a curable silicone composition includes: (A) an alkenyl group-containing organopolysiloxane having at least two alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; (C) an epoxy group-containing resinous organopolysiloxane represented by Average Unit Formula (I): (RSiO)(RSiO)(RSiO)(SiO)(XO)wherein Rare independently halogen-substituted or unsubstituted monovalent hydrocarbon groups, at least two Rare alkenyl groups; Rare independently halogen-substituted or unsubstituted monovalent hydrocarbon groups or epoxy group-containing organic groups, wherein at least one Ris an epoxy group-containing organic group; X is a hydrogen atom or an alkyl group; 0≤f<1; 0<g<1; 0≤h<0.9; 0≤i<0.5; and 0<j<0.5; f+g+h+i+j=1.0; h+i>0; and j/(f+g+h+i+j)>0.05 and (D) a curing catalyst.

Curable silicone composition, encapsulant and optical semiconductor device

A curable silicone composition is disclosed. The composition comprises: (A) a hydrosilylation-reactive resin-linear block copolymer type organopolysiloxane; (B) an organopolysiloxane resin containing a curing-reactive group having a carbon-carbon double bond in the molecule; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst. An absolute value (ΔRI) of a difference between refractive indices of component (A) and component (B) measured at room temperature is less than 0.05. The curable silicone composition generally has excellent handleability, moldability, and mechanical strength (hardness, in particular) and flexibility of a cured product while achieving high transparency. Also disclosed is a resin sheet for an optical member including the composition or cured product thereof, and a light-emitting device or the like including the composition or cured product thereof.

Curable silicone composition, optical member resin sheet comprising same, and light-emitting device

A curable silicone composition is disclosed. The curable silicone composition comprises: (A) a linear organopolysiloxane having at least two alkenyl groups and at least one aryl group in a molecule; (B) a branched organopolysiloxane represented by the average unit formula; (C) an organosiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule; and (D) a hydrosilylation reaction catalyst. The curable silicone composition forms a cured product having good mechanical properties and good retention of transparency under conditions of high temperature.

Curable silicone composition, cured product thereof, and optical semiconductor device

The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane resin having at least two alkenyl groups in a molecule; (B) an organopolysiloxane represented by a general formula; (C) an organosiloxane (C) having silicon-bonded hydrogen atoms at both molecular terminals, an organopolysiloxane (C) having at least two silicon-bonded hydrogen atoms in a molecule, or a mixture of components (C) and (C); and (D) a hydrosilylation reaction catalyst. The curable silicone composition has excellent handleability and can form a cured product with a high refractive index and low gas permeability when cured.

The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane represented by a specific average unit formula, (B) an optional straight-chain organopolysiloxane having at least two alkenyl groups and not having any silicon-bonded hydrogen atoms in a molecule, (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, and (D) a hydrosilylation reaction catalyst. The curable silicone composition has high reactivity and forms a cured product with low gas permeability.

Organopolysiloxane, curable silicone composition, cured product thereof, and optical semiconductor

An aryl group-containing siloxane composition is formed by introducing an alkaline earth-metal as a part of the reaction product of an organopolysiloxane having at least two alkenyl groups per molecule and an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule in the presence of a hydrosilylation catalyst, wherein at least one of the organopolysiloxanes includes an aryl group. The alkaline earth metal may be introduced via a heat stability composition or may alternatively be pre-reacted with the organopolysiloxane having at least two alkenyl groups per molecule. The aryl group-containing siloxane compositions may be utilized as an encapsulating layer for a light emitting device.

Aryl group-containing siloxane compositions including alkaline earth metal

The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule and represented by the average unit formula; (B) a straight chain organopolysiloxane having at least two alkenyl groups in a molecule and having no silicon-bonded hydrogen atoms; (C) an organosiloxane i) represented by the general formula, an organopolysiloxane (C) having at least two silicon-bonded hydrogen atoms in a molecule and represented by the average unit formula, or a mixture of components (C) and (C); and (D) a hydrosilylation reaction catalyst. The curable silicone composition forms a cured product having a high refractive index and a low gas permeability.

Curable silicone composition, cured product thereof, and optical semiconductor

A silsesquioxane resin is applied on top of the patterned photo-resist and cured to produce a cured silsesquioxane resin on top of the pattern surface. Subsequently, an aqueous base stripper or a reactive ion etch recipe containing CFis used to 'etch back' the silicon resin to the top of the photoresist material, exposing the entire top surface of the photoresist. Then, a second reactive ion etch recipe containing Oto etch away the photoresist. The result is a silicon resin film with via holes with the size and shape of the post that were patterned into the photoresist. Optionally, the new pattern can be transferred into the underlying layer(s).

Method and materials for reverse patterning

Disclosed is silsesquioxane resin composition that contains a free radical curable functional group that is stabilized with a hydrophilic inhibitor. The hydrophilic inhibitor that has the capability to scavenge free radicals such as ascorbic acid or salicylic acid is used to stabilize the resin. The resins are useful in semiconductor formation such as for anti-reflective coatings, hardmasks or photoresist layers.

Stabilization of silsesquioxane resins

A curable organopolysiloxane resin composition having a viscosity at 25&#xb0; C. in the range of 0.001 to 5,000 Pa&#xb7;s, a total acid number as specified by JIS K 2501 (1992) in the range of 0.0001 to 0.2 mg/g, and light transmittance in a cured state equal to or greater than 80%; an optical part comprised of a cured body of the aforementioned composition. The curable organopolysiloxane resin composition of the invention is characterized by good transparency, low decrease in transmittance when exposed to high temperatures, and excellent adhesion when required.

Curable organopolysiloxane resin composition and optical part molded therefrom

The present invention relates to an active energy ray-curable organopolysiloxane resin composition that comprises an organopolysiloxane resin having an epoxy group and an aromatic hydrocarbon group and a photopolymerization initiator, as well as to a light-transmitting component that comprises cured bodies produced by irradiating the aforementioned organopolysiloxane resin with active-energy rays in the presence of the aforementioned photopolymerization initiator, and to a method for manufacturing the aforementioned light-transmitting component.

Active energy ray-curable, organopolysiloxane resin composition, light-transmitting component, and method for manufacturing the light-transmitting component

Addition-curable organopolysiloxane resin composition comprising an organopolysiloxane resin that contains at least alkenyl, hydroxyl, and phenyl directly bonded to silicon of which at least 30 mole % is phenyl; an organohydrogenoligosiloxane or organohydrogenpolysiloxane that contains at least phenyl directly bonded to silicon of which at least 20 mole % is phenyl; and an addition reaction-curing catalyst.

Addition-curable organopolysiloxane resin composition

An addition-curable organopolysiloxane resin composition having, in a state of cued body, a hardness of 60 to 100 at 25 degree C. and 40 to 100 at 150 degree C. as measured in accordance with the provisions of ASTM D2240-86, said composition comprising: (A) 100 parts by weight of an organopolysiloxane resin comprised of at least alkenyl groups and phenyl groups; (B) 10 to 50 parts by weight of an organooligosiloxane comprised of at least alkeyl groups and phenyl groups; (C) 20 to 100 parts by weight of an organohydrogenoligosiloxane of organohydrogenpolysiloxane; and (D) an addition-reaction catalyst in a catalytic quantity; an optical material that is comprised of a cured body produced from aforementioned components (A), (B), and (C) and possesses the aforementioned characteristics.

Additional-curable organopolysiloxane resin composition and an optical material

Growing community of inventors

Ichihara, Japan

Kasumi Takeuchi