Kioxia Corporation

Kasumi Okabe

Hirokazu Kato

Takeshi Higuchi

Kei Kobayashi

Daizo Muto

A measuring method includes: placing resiston a surface of a test film; pressing a templateagainst the resistplaced on the surface of the test film; measuring a size of a void formed in the resistafter pressing the templateagainst the resist; and determining gas permeability of the test film based on the size of the void.

Measuring method and measuring apparatus

An imprint device includes a load port for receiving a substrate to be processed, a sensor that acquires information from the substrate about a film on the substrate, and a primer forming unit configured to receive the substrate from the load port. A controller is configured to select primer process conditions corresponding to the film information. The primer forming unit receives primer process conditions from the controller and forms a primer layer on the substrate over the film. The primer layer is formed according to the selected process conditions. An imprinting unit of the imprint device is configured to receive the substrate from the primer forming unit and perform imprint lithography on the substrate.

Imprint device, imprint method, and semiconductor device manufacturing method

An imprinting method includes dispensing a first liquid on a first region of a substrate. The first liquid is a photocurable resist precursor. A second liquid is dispensed on a second region of the substrate. The second region is adjacent to and surrounding the first region. The second liquid is non-photocurable as dispensed. The first region is then irradiated with light while a patterned template is being pressed against the first liquid. The light cures the first liquid and forms a resist pattern corresponding to the patterned template. The patterned template and the substrate are then separated from each other. The second liquid is then selectively removed from the substrate while leaving the resist pattern on the substrate.

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Yokohama Kanagawa, Japan

Kasumi Okabe