3m Innovative Properties Company

Karunasena A Alahapperuma

Greggory S Bennett

Cheryl L Moore

Richard E Bennett

Louis E Winslow

Edward J Woo

Steven S Kantner

Peter A Stark

Craig F Lamphere

Joseph G Pribyl

A structured abrasive article comprises a backing with a topographically structured abrasive layer secured thereto. The topographically structured abrasive layer comprises precisely-shaped abrasive composites. A solid overlayer comprising eroding particles with a Mohs scale hardness of at least 4 and a water-soluble polymer is disposed on at least a portion of the topographically structured abrasive layer. Methods of making and using the structured abrasive articles are also disclosed.

Structured abrasive with overlayer, and method of making and using the same

Clear adhesive sheet

A semiconductor wafer processing tape includes a permanent backing and a layer of a nonpressure sensitive adhesive. The tapes are useful for wafer grinding and/or wafer dicing applications. The nonpressure sensitive adhesive includes a copolymer of at least one of a first monoethylenically unsaturated monomer, at least one of a second monoethylenically unsaturated monomer, and at least one copolymerizable nonionic crosslinking agent; wherein the second monoethylenically unsaturated monomer is a reinforcing monomer having a homopolymer glass transition temperature higher than that of the first monoethylenically unsaturated monomer. A method of processing semiconductor wafers is also provided.

Semiconductor wafer processing tapes

Growing community of inventors

Austin, TX, United States of America

Karunasena A Alahapperuma