Applied Materials, Inc.

Karthik Elumalai

Sriskantharajah Thirunavukarasu

Eng Sheng Peh

Jen Sern Lew

Mingwei Zhu

Jun-Liang Su

Dimantha Rajapaksa

Arvind Sundarrajan

Nag B Patibandla

James S Papanu

Yong Cao

Guan Huei See

Daniel Lee Diehl

Prayudi Lianto

Tuck Foong Koh

Karthik Balakrishnan

Cheng Sun

Shoju Vayyapron

Mohamed Rafi

Gaurav Mehta

Sai Abhinand

Thean Ming Tan

Arunkumar M Tatti

Muhammad Azim Bin Syed Sulaiman

Ang Yu Xin Kristy

Michael Sorensen

Sri Thirunavukarasu

Onkara Korasiddaramaiah

In an embodiment, a semiconductor processing tool for implementing hybrid laser and plasma dicing of a substrate is provided. The semiconductor processing tool comprises a transfer module, where the transfer module comprises a track robot for handling the substrate, and a loadlock attached to the transfer module. In an embodiment, the loadlock comprises a linear transfer system for handling the substrate. In an embodiment, the processing tool further comprises a processing chamber attached to the loadlock, wherein the linear transfer system of the loadlock is configured to insert and remove the substrate from the processing chamber.

Mainframe-less wafer transfer platform with linear transfer system for wafer processing modules

Electrostatic chucks with reduced current leakage and methods of dicing semiconductor wafers are described. In an example, an etch apparatus includes a chamber, and a plasma source within or coupled to the chamber. An electrostatic chuck is within the chamber. The electrostatic chuck includes a conductive pedestal having a plurality of notches at a circumferential edge thereof. The electrostatic chuck also includes a plurality of lift pins corresponding to ones of the plurality of notches.

Electrostatic chuck with reduced current leakage for hybrid laser scribing and plasma etch wafer singulation process

Methods and apparatus for producing fine pitch patterning on a substrate. Warpage correction of the substrate is accomplished on a carrier or carrier-less substrate. A first warpage correction process is performed on the substrate by raising and holding a temperature of the substrate to a first temperature and cooling the carrier-less substrate to a second temperature. Further wafer level packaging processing is then performed such as forming vias in a polymer layer on the substrate. A second warpage correction process is then performed on the substrate by raising and holding a temperature of the substrate to a third temperature and cooling the substrate to a fourth temperature. With the warpage of the substrate reduced, a redistribution layer may be formed on the substrate with a 2/2 &#x3bc;m l/s fine pitch patterning.

Methods and apparatus for controlling warpage in wafer level packaging processes

Embodiments of improved substrate carriers are provided herein. In some embodiments, a substrate carrier, includes: a multi-layered disk having upper and lower layers formed of a continuous material and an electrostatic electrode structure disposed therebetween, wherein the multi-layered disk is dimensioned and arranged so as to have a nominal dimension which exceeds a nominal dimension of a standard substrate size used in the manufacture of light emitting diode devices, and wherein the multi-layered disk is formed symmetrically about a central axis and defines a substantially planar upper surface.

Substrate carrier system utilizing electrostatic chucking to accommodate substrate size heterogeneity

Systems, apparatuses and methods for determining a surface profile of a substrate are provided. In one embodiment, a method includes projecting a signal having a vertical component/profile across the surface of the substrate from a plurality of locations along a first side of the substrate, capturing the projected signals at each of a plurality of respective locations across the surface of the substrate and determining a surface profile for the substrate using the captured signals. The process can be automated using a controller having predetermined projection and capture positions along respective sides of the substrate, where a surface profile of the substrate can be automatically determined by the controller using the captured signals.

Next generation warpage measurement system

Embodiments of methods and apparatus for correcting substrate deformity are provided herein. In some embodiments, a substrate support includes a base having an interior volume formed by walls extending upward from the base; a plurality of infrared lamps disposed within the interior volume; a support plate disposed above the plurality of infrared lamps, wherein the support plate includes a support surface to support a substrate; and a cover plate disposed atop the support plate and having a central opening corresponding to the support surface and an exhaust portion at a periphery of a top surface of the cover plate, wherein the exhaust portion includes a plurality of perforations fluidly coupling a space above the cover plate with an exhaust conduit formed in the cover plate. Embodiments of a showerhead assembly and processing equipment incorporating the inventive substrate support and showerhead assembly are additionally provided herein.

Methods and apparatus for correcting substrate deformity

Embodiments of methods and apparatus for correcting substrate deformity are provided herein. In some embodiments, a substrate flattening system includes: a first process chamber having a first substrate support and a first showerhead, wherein the first substrate support does not include a chucking mechanism; a first heater disposed in the first substrate support to heat a substrate placed on a first support surface of the first substrate support; a second heater configured to heat a process gas flowing through the first showerhead into a first processing volume of the first process chamber; and a second process chamber having a second substrate support, wherein the second substrate support is not heated, and wherein the first process chamber and the cooling chamber are both non-vacuum chambers.

An electrostatic carrier is described for carrying a substrate for handling through different processes. The carrier has a dielectric plate having a top side and a bottom side and configured to be attached on a top side of the plate to a substrate using electrostatic force, and a base plate coupled to a bottom side of the dielectric plate. Electrodes are formed on the base plate and extend across the base plate parallel to the top side of the dielectric plate. The electrodes are configured to carry an electrostatic charge and formed so that electrodes of a first charge are positioned near electrodes of a second charge. Connectors extend through the base plate to the electrodes to couple the electrodes to a source of electrostatic charge.

Electrostatic carrier for handling substrates for processing

In some embodiments, a substrate carrier for holding a plurality of substrates comprises a disk formed of a continuous material to a nominal dimension which is approximately a multiple of a nominal dimension of a standard substrate size used in the manufacture of light emitting diode devices. In an embodiment, the disk is formed symmetrically about a central axis and defines a substantially planar upper surface. A first pair of pockets is defined in the upper surface of the disk, wherein the disk and each of the first pair of pockets are bisected by a first reference plane passing through the central axis. A second pair of pockets is defined in the upper surface of the disk, wherein the disk and each of the second pair of pockets are bisected by a second reference plane passing through the central axis.

Reusable substrate carrier

Growing community of inventors

Bengaluru, India

Karthik Elumalai