Hamilton Sundstrand Corporation

Goodrich Corporation

Karthik Debbadi

Galdemir Cezar Botura

Sebastian Pedro Rosado

Jeffrey Ewanchuk

Sugumaran Selvaraj

Fabien Dubois

Alex Zadell

El Hassan Ridouane

A semiconductor device package includes a multilayer substrate including atop layer, a bottom layer and an intermediate layer between the top layer and the bottom layer. The package also includes one or more semiconductor dies embedded in the intermediate layer and conductive connector means to provide a conductive connection from the one or more dies. The conductive connector means extend through the top layer to provide connection means for one or more devices mounted on or adjacent the top layer.

Plurality of dies electrically connected to a printed circuit board by a clip

A method of controlling a power converter having a plurality of parallel-connected switching devices, the method comprising: measuring a threshold voltage of each of the parallel switching devices at start up of the parallel power converter in an initial self-calibration process; and determining synchronization of a time at which the threshold voltages of the respective switching devices occur.

Parallel switch current control

Growing community of inventors

Cork, Ireland

Karthik Debbadi