Infineon Technologies Ag

Karsten Wolff

Ulrich Nolten

A housing for a power semiconductor module includes sidewalls and a top that includes a first surface extending in a first horizontal plane and a second surface opposite and in parallel to the first surface, a plurality of openings of a first kind, each of the plurality of openings of the first kind including a first through hole extending through the top from the first surface to the second surface, and a plurality of openings of a second kind, each of the plurality of openings of the second kind comprising a second through hole extending through the top from the first surface to the second surface. Each of the plurality of openings of the first kind includes a collar or sleeve. Each of the plurality of openings of the second kind includes a trench or indentation arranged adjacent to and forming a closed loop around the respective second through hole.

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Soest, Germany

Karsten Wolff