Rogers Germany Gmbh

Curamik Electronics Gmbh

Karsten Schmidt

Andreas Meyer

Tilo Welker

Jürgen Schulz-Harder

Stefan Britting

Karl Exel

Eckart Hoene

Xinhe Tang

Lothar Kugler

Rainer Herrmann

Alexander Legath

Lei Liu

Martina Schmirler

Ruben Kahle

Christoph Wehe

Fabian Wagle

Christoph Marczok

Tina Thomas

Yang Zhong

Martin Reger

The invention relates to a process for producing a metal-ceramic substrate (), comprising:

Process for producing a metal-ceramic substrate, and a metal-ceramic substrate produced using such method

A solder material () for bonding a metal layer () to a ceramic layer (), in particular for forming a metal-ceramic substrate as a carrier for electrical components, comprising:

Solder material, method for producing a solder material of this type and use of a solder material of this type in order to connect a metal layer to a ceramic layer

A support substrate (), in particular a metal-ceramic substrate, as a support for electric components, comprising: —at least one metal layer () and—an insulating element (), in particular a ceramic element, a glass element, a glass ceramic element, and/or a high temperature-resistant plastic element. The at least one metal layer () and the insulating element () extend along a main extension plane (HSE) and are arranged one over the other in a stacking direction (S) running perpendicularly to the main extension plane (HSE), wherein in a completed support substrate (), a binding layer () is formed between the at least one metal layer () and the insulating element (), and an adhesive layer () of the binding layer () has a surface resistance which is greater than 5 Ohm/sq.

Support substrate and method for producing a support substrate

An electronics module (), especially a power electronics module, comprising

Electronic module and method for producing an electronic module

A method for manufacturing a metal-ceramic substrate () includes

Method for producing a metal-ceramic substrate, solder system, and metal-ceramic substrate produced using such a method

A substrate () for electrical circuits, comprising at least one metal layer () and a paper ceramic layer (), which is joined face to face with the at least one metal layer () and has a top side and bottom side (), wherein the paper ceramic layer () has a large number of cavities in the form of pores. Especially advantageously, the at least one metal layer () is connected to the paper ceramic layer () by means of at least one glue layer (), which is produced by applying at least one glue (&#x2033;) to the metal layer () and/or to the paper ceramic layer (), wherein the cavities in the form of pores in the paper ceramic layer () are filled at least at the surface by means of the applied glue (&#x2033;).

Substrate for electrical circuits and method for producing a substrate of this type

The invention relates to a substrate () for electrical circuits comprising at least one first composite layer () which is produced by means of roll cladding and, after said roll cladding, has at least one copper layer () and an aluminium layer () attached thereon, wherein at least the surface side of the aluminium layer () facing away from the copper layer () is anodized for the generation of an anodic or insulating layer () made of aluminium oxide, and wherein the anodic or insulating layer () made of aluminium oxide is connected to a metal layer () or at least one second composite layer (') or at least one paper-ceramic layer () via at least one adhesive layer (&#x2032;).

A metal-ceramic substrate having at least one ceramic layer (), which is provided on a first surface side () with at least one first metallization () and on a second surface side (), opposite from the first surface side (), with a second metallization (), wherein the first metallization () is formed by a film or layer of copper or a copper alloy and is connected to the first surface side () of the ceramic layer () with the aid of a 'direct copper bonding' process. The second metallization () is formed by a layer of aluminum or an aluminum alloy.

Metal-ceramic substrate

The invention relates to a metal-ceramic substrate and to a method for the production thereof, the substrate including at least one ceramic layer having first and second surface sides, at least one of the surface sides of which is provided with a metallization, wherein the ceramic material forming the ceramic layer contains aluminum oxide, zirconium dioxide and yttrium oxide. The ceramic layer contains aluminum oxide, zirconium dioxide and yttrium oxide in the following proportions, in each case in relation to the total weight thereof: zirconium dioxide between 2 and 15 percent by weight; yttrium oxide between 0.01 and 1 percent by weight; and aluminum oxide between 84 and 97 percent by weight, wherein the average grain size of the aluminum oxide used is between 2 and 8 micrometers and the ratio of the length of the grain boundaries of the aluminum oxide grains to the total length of all the grain boundaries is greater than 0.6.

Metal-ceramic substrate and method for producing a metal-ceramic substrate

A mirror for laser application and a method for manufacturing the mirror is disclosed herein. The mirror comprises several layers including a top layer used as the mirror surface. A cooling structure including a plurality of cooler layers are providing between the top layer, several intermediate layers and a bottom layer. Connections are provided for allowing a coolant to flow within the mirror. The mirror is constructed by stacking the layers on top of one another and connecting adjacent layers together by direct copper bonding or active soldering.

Mirror for laser applications and method for manufacture of said mirror

The invention relates to a novel ceramic substrate with at least one layer essentially of aluminum nitride which is provided on at least one surface side with an intermediate or auxiliary layer which contains aluminum oxide and which has a thickness in the range of 0.5-10 microns, and to a process for its production.

Growing community of inventors

Eschenbach, Germany

Karsten Schmidt