Seagate Technology Incorporated

Karsten Klarqvist

Declan Macken

Jason Bryce Gadbois

Andrew Robert Motzko

Rick Pfahl Freeman

A bond pad set includes at least one ground pad and at least one electrical bond pad configured to bias and send/receive signals. The bond pad set is electrically connected to a multiplicity of electrical components. At least one electrical bond pad of the bond pad set is shared between two or more of the electrical components.

Bond pad sharing for powering a multiplicity of electrical components

A system includes a first preamplifier, a second preamplifier and a flex circuit. The first preamplifier is configured to be connected to a first plurality of recording heads. The second preamplifier is configured to be connected to a second plurality of recording heads. At least one of the first plurality of recording heads and at least one of the second plurality of recording heads are configured to concurrently perform read and or write operations. The flex circuit is a single flex circuit configured to connect the first and second preamplifiers to the plurality of recording heads.

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Roseville, MN, United States of America

Karsten Klarqvist