Texas Instruments Corporation

Texas Instruments Incorporated Deutschland, Gmbh

Karsten Jens Spinger

Joel Martin Halbert

Doug Weiser

Wolfgang Heinz Schwartz

Christoph Andreas Othmar Dirnecker

Joseph Anthony DeSantis

Christoph Dirnecker

Franz Stingl

In one example an electronic device includes a first resistor and a second resistor. The first resistor includes a first resistive layer located over a substrate, the first resistive layer having a first sheet resistance. The second resistor includes a first portion of a second resistive layer located over the substrate, the second resistive layer having a second sheet resistance different from the first sheet resistance. The first resistive layer is located between the substrate and a second noncontiguous portion of the second resistive layer.

Method and structure for dual sheet resistance trimmable thin film resistors

A method of forming an electronic device includes forming an opening through a dielectric layer located over a first resistive layer, the first resistive layer having a first sheet resistance. A second resistive layer is deposited over the dielectric layer and into the opening. The second resistive layer has a second sheet resistance different from the first sheet resistance. A portion of the second resistive layer is removed, thereby forming first and second noncontiguous portions of the second resistive layer, wherein the second portion of the second resistive layer contacts the first resistive layer.

An integrated circuit includes a higher sheet resistance resistor and a lower sheet resistance resistor, disposed in a same level of dielectric layers of the integrated circuit. The higher sheet resistor has a body region and head regions in a higher sheet resistance layer. The lower sheet resistor has a body region and head regions in a lower sheet resistance layer, which is thicker than the higher sheet layer. The higher sheet resistor has an upper head layer contacting the higher sheet layer at each head region of the higher sheet layer. Each upper head layer has a same composition and thickness as the lower sheet layer of the lower sheet resistor. The lower sheet resistor is free of head layers over the lower sheet resistance layer.

Method and structure for dual sheet resistance trimmable thin film resistors at same level

An integrated circuit contains three thin film resistors over a dielectric layer. The first resistor body includes only a bottom thin film layer and the first resistor heads include the bottom thin film layer, a middle thin film layer and a top thin film layer. The second resistor body and heads include all three thin film layers. The third resistor body does not include the middle thin film layer. The three resistors are formed using two etch masks.

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Ingolstadt, Germany

Karsten Jens Spinger