Schott Ag

Karsten Droegemüller

Artit Aowudomsuk

Andreas Krause

Amy Soon Li Ping

Ong Wai Li

Amy Soon

Yin Cheng Wong

A conductor track arrangement for high-frequency signals is provided. The arrangement includes a carrier, a ground conductor, and a pair of signal conductors. The signal conductors are layered and are arranged on the carrier opposite the ground conductor. A distance is between the signal conductors, which have a deflection region, in which a direction of the signal conductors changes. The deflection region has a reduced distance, which is reduced compared to the distance d between the signal conductors outside the deflection region. The distance between the signal conductors in transition regions from straight portions of the signal conductors into the deflection region is reduced here symmetrically with respect to an extension of a centre line between the two signal conductors into their respective straight portions and/or a capacitor is introduced into the signal conductor considered to be the inner signal conductor in respect of the direction change.

Conductor track arrangement for high-frequency signals, base and electronic component having a conductor track arrangement

A conductor track arrangement for high-frequency signals is provided. The arrangement has a carrier and a layered signal conductor arranged on the carrier. The layered signal conductor is delimited by a first end, a second end, an inner edge, and an outer edge. The layered signal conductor changes direction in a deflection area and has a minimum width in the deflection area. At least one of the inner and outer edges has a curvature in the deflection area. The deflection area is between the first and second ends.

High-frequency feed line and electronic component with high-frequency feed line

A header for an electronic component including a base body, a thermoelectric cooler, a carrier and first and second conductor track arrangements. The thermoelectric cooler is thermally attached to the base body. The carrier is coupled to the thermoelectric cooler and is cooled thereby. The first and second conductor track arrangements each have a signal conductor, at least one grounding conductor and an end. The second conductor track arrangement is on the carrier and connected to the electronic component. The first and second conductor track arrangements are separated by a gap that is bridged by bonding wire connections electrically connecting the first and second signal conductors and electrically connecting the two grounding conductors, the ends facing each other across the gap, at least one of the ends having a capacitive structural feature that increases the capacitance of the first and/or the second conductor track arrangement.

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Eichenau, Germany

Karsten Droegemüller