Schott Ag

Karsten Droegemueller

Artit Aowudomsuk

Kenneth Tan

Robert Hettler

Amy Soon Li Ping

Ong Wai Li

Andreas Krause

Rudolf Jungwirth

Jian Dean Tan

Georg Mittermeier

Amy Soon

Michelle YanYan Fang

A header for opto-electronic applications is provided. The header includes a header base with a back face, a front face, and opening that extends from the back face through the base to the front face. The opening accommodates an electrically isolated pin through the opening. A pedestal is arranged at the front face and is below a center of the opening. The pedestal has a mounting face and a free face, which opposes the mounting face. The pedestal further includes an upper surface for mounting and carrying a pedestal submount. The mounting face is fixedly attached to the front face with an electrically conductive material that is at least partially arranged between the front face and the mounting face. An electrically isolating material is arranged in the opening between the base and the pin to electrically isolate the pin from the base.

Transistor outline header for high-speed data transmission of optoelectronic applications

A header for electronic components is provided. The header has a base with at least two electrical feedthroughs each having a feedthrough pin extending through the base and being electrically isolated to the base within the feedthrough. The further includes at least one pedestal connected to the base and two submounts. Each submount includes a carrier with a structured conductor plating that has at least two conductor traces with one of the conductor traces of each submount being electrically connected to one of the feedthrough pins. The submounts are equally formed but mounted in different orientations.

Header for an electric component

A transistor outline package is provided that includes a header with a mounting area for an optoelectronic component. The header has a signal pin disposed in a feedthrough. The feedthrough is filled with an insulating material made of glass and/or glass ceramic. The feedthrough has a recessed area on at least one side that is not completely filled up with the insulating material. The recessed area defines a cavity at least partially around the signal pin and the signal pin has an enlarged portion in the recessed area.

Transistor outline package with glass feedthrough

A transistor outline package is provided that includes a header having an upper surface, a lower surface, an inner surface, and a mounting area for an optoelectronic component in the inner surface. The header has a signal pin configured to connect an optoelectronic component. The signal pin is disposed in a feedthrough and protrudes from the lower surface. A printed circuit board attached on the signal pin substantially coaxially thereto. The printed circuit board is mechanically and electrically connected to the header by a metal block arranged adjacent to the feedthrough to provide grounding.

Transistor outline package with ground connection

A transistor outline housing is provided that includes a header for an optoelectronic component. The header has electrical feedthroughs in the form of connection pins embedded in a potting compound. The header has a recess in which at least one of the connection pins in one of the feedthroughs extends out of the lower surface of the header.

Transistor outline housing with high return loss

A transistor outline (TO) housing comprising a base part having a mounting area for a thermoelectric cooler, wherein the base part has at least two feedthroughs for connecting an optoelectronic component. A support extends from the upper surface of the base part, which support has at least two conductor traces arranged thereon, each of which is connected to a respective one of the feedthroughs for connecting the optoelectronic component.

Transistor outline housings for distributed feedback lasers

A transistor outline housing is provided that has bonding wires on an upper surface. The bonding wires are reduced in length and have connection leads with an excess length at an end opposite the bonding end.

Growing community of inventors

Eichenau, Germany

Karsten Droegemueller