Rockley Photonics Limited

Texas Instruments Corporation

Texas Instruments Incorporated Deutschland, Gmbh

Intel Corporation

Karlheinz Muth

Chia-Te Chou

Gerald Cois Byrd

Vivek Raghunathan

David Arlo Nelson

Vivek Raghuraman

Aaron John Zilkie

Hooman Abediasl

Yi Zhang

Brett Sawyer

SeungJae Lee

Martin Braier

Gregory Eric Howard

Mark William Morgan

David Erich Tetzlaff

Brent Ryan Rothermel

Gerd Schuppener

Yanli Fan

Thomas Pierre Schrans

Dong Yoon Oh

Frank Gelhausen

Amneh Mohammad Akour

Javid Messian

James Dongyoon Oh

Lothar Schmidt

An optoelectronic device, including: a rib waveguide, the rib waveguide including: a ridge portion, which includes a temperature-sensitive optically active region, and a slab portion, positioned adjacent to the ridge portion; the device further comprising a heater, disposed on top of the slab portion wherein a part of the heater closest to ridge portion is at least 2 &#x3bc;m away from the ridge portion. The device may also have a heater provided with a bottom cladding layer, and may also include various thermal insulation enhancing cavities.

Optoelectronic device

An optical engine. In some embodiments, the optical engine includes an electronic interfacing component including: an upper surface having a plurality of conductors for forming a corresponding plurality of connections to a host board, a lower surface having a plurality of conductors for forming a corresponding plurality of connections to one or more optoelectronic elements, and a plurality of vias extending from the lower surface to the upper surface.

Optical engine

A system including an optical engine. In some embodiments, the system includes an integrated circuit in a first-level package, and the system includes the optical engine, in the first-level package, and the optical engine includes an electro-optical chip.

An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.

Module with transmit optical subassembly and receive optical subassembly

An electro-optical package. In some embodiments, the electro-optical package includes a first electro-optical chip coupled to an array of optical fibers, and a first physical medium dependent integrated circuit coupled to the first electro-optical chip.

Electro-optical package and method of fabrication

A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.

Copackaging of asic and silicon photonics

An electro-optical package. In some embodiments, the package includes an electronic integrated circuit module, a first electro-optical component, and a photonic integrated circuit. The first electro-optical component may be in a top surface of the photonic integrated circuit. The electronic integrated circuit module may have a top surface facing toward and overlapping both a portion of the first electro-optical component, and a portion of the photonic integrated circuit.

Module with transmit and receive optical subassemblies with specific pic cooling architecture

Electronic devices and associated methods are shown including a connector mounted to a printed circuit board (PCB). Examples shown include a number of ground vias passing through the PCB to a second side of the PCB, wherein the number of ground vias is smaller than a number of ground sites. Selected examples include an optoelectronic connector mounted using surface mount technology.

Ground routing device and method

An apparatus is provided. The apparatus generally comprises a plurality of pairs of differential transmission lines. The plurality of pairs of differential transmission lines includes a set of pairs of differential transmission lines with each pair of differential transmission lines from the set of pairs of differential transmission lines including at least one twist to alternate current direction. Also, the plurality of differential transmission lines are arranged such that alternating current directions substantially eliminate cross-talk across the plurality of pairs of differential transmission lines.

Differential transmission line pairs using a coupling orthogonalization approach to reduce cross-talk

A CMOS LC-tank oscillator includes a pair of symmetric inductors and a differential pair of transistors. The inductors have a first one of their terminals interconnected at a supply node to which a voltage supply is applied through a supply resistor and a second terminal connected to the drain of a respective one of the transistors. The transistors have their sources interconnected at a tail node which is connected to ground through a tail resistor. A current control loop controls a core current between the supply and tail nodes so as to keep a voltage drop across the tail resistor at a level determined by a reference voltage. The current control loop keeps the core current between the supply and tail nodes at the required level so that a resistor may replace the upstream supply voltage regulator and another resistor may replace the downstream bias regulator. Consequently, sources of noise injected into the LC-tank type oscillator are eliminated.

CMOS LC-tank oscillator

An integrated preamplifier circuit for detecting a signal current from a photodiode and converting the signal current into an output voltage is provided. The circuit includes a signal amplifier and a dummy amplifier, the dummy amplifier being matched to the signal amplifier. Each of these amplifiers includes an input transistor and an output transistor, the input transistor of the signal amplifier receiving an input signal derived from the signal current and the input transistor of the dummy amplifier receiving no input signal. The signal and dummy amplifiers provide the desired differential output signal. The input transistors of the signal and dummy amplifiers each have a biasing current source forced to follow a reference current source implemented within the integrated circuit.

Integrated preamplifier circuit for detecting a signal current from a photodiode

A transimpedance amplifier circuit comprising transistors, a constant current source, a load resistor, and the feedback resistor with a shunt circuitry consisting of the additional transistors, which are driven for example with electrically adjustable voltage sources. In a bipolar npn implementation the amplifier stage consists of a common emitter input transistor Q, a transistor Qwith its base connected to the collector of the first transistor operates as an emitter follower. A resistor RF connected between the emitter of said second transistor and the base of said first transistor provides a voltage controlled current feedback from the amplifier output to its input. The output voltage VOUT is generated at the emitter node of said second transistor. A shunt circuitry consists of a third and a fourth transistor Qand Qconnected in shunt across resistor RF. In an embodiment, the base node voltages of the transistors Qand Qare adjusted by control voltage sources. By means of an appropriate implementation of these voltage sources the maximum and minimum limits of the output voltage VOUT is defined, which can easily be implemented with arbitrary temperature or supply voltage dependency.

Growing community of inventors

Richardson, TX, United States of America

Karlheinz Muth