Osram Opto Semiconductors Gmbh

Osram Gmbh

Siemens Aktiengesellschaft

Osram Opto Semi-conductors Gmbh Co. Ohg

Osram Opto Semiconductor Gmbh

Oram Gmbh

Karlheinz Arndt

Georg Bogner

Günter Waitl

Herbert Brunner

Franz Schellhorn

Hans Krueger

Tobias Gebuhr

Wolfgang Welsch

Klaus Höhn

Klemens Huebner

Peter Mammach

Markus Schneider

Stefan Grötsch

Simon Jerebic

Moritz Engl

Bert Braune

Stefan Gruber

Hans-Christoph Gallmeier

Thomas Schlereth

Kirstin Petersen

Christian Gaertner

Albert Schneider

Guenter Waitl

Matthias Winter

Michael Bestele

Michael Hiegler

Nadir Farchtchian

G&uuml;nter Waitl

Peter Holzer

Josef Schmid

Huey Ling Rena Lim

The invention relates to a housing for a radiation-emitting component, having the following features: —at least one electric contact point which is arranged on a first main surface of the housing and—at least one depression in the first main surface of the housing, said depression being arranged adjacently to the electric contact point. The invention additionally relates to a method for producing a radiation-emitting component and to a radiation-emitting component.

Radiation-emitting component and method for producing same

In one embodiment, the light-emitting diode module comprises a carrier and a plurality of light-emitting diodes. Thereby, several types of light-emitting diodes are present. The light-emitting diodes can be controlled individually or in groups electrically independently of one another. The light-emitting diodes each comprise a first and a second electrical contact. The carrier comprises several electrically conductive main layers, between each of which there is an electrically insulating intermediate layer. The contacts of the light-emitting diodes are attached to a carrier upper side on one of the first main layers. Starting from the first contacts, electrical through-connections are each connected directly to a carrier underside with a last main layer of the main layers. Starting from the second contacts, electrical through-connection each terminate at a penultimate main layer of the main layers, wherein the penultimate main layer is located inside the carrier.

Light-emitting diode module and assembly with a light-emitting diode module

In one embodiment, the method is configured for producing optoelectronic semiconductor components () and includes the steps of:

Method for producing optoelectronic semiconductor components, leadframe assembly and optoelectronic semiconductor component

An optoelectronic semiconductor component comprising at least one radiation emitting semiconductor chip disposed in a recess of a housing base body, wherein the recess is bounded laterally by a wall surrounding the semiconductor chip and is at least partially filled with an encapsulant that covers the semiconductor chip and is well transparent to an electromagnetic radiation emitted by the semiconductor chip An inner side of the wall, bounding the recess, is configured such that, as viewed looking down on the front side of the semiconductor component, a subarea of the inner side is formed which extends ring-like all the way around the semiconductor chip and which is in shadow as viewed from the radiation emitting semiconductor chip and which is at least partially covered by encapsulant all the way around the semiconductor chip. A housing base body for such a semiconductor component is also specified.

Optoelectronic semiconductor component and housing base for such a component

A package body () with an upper side (), with an underside (), opposite from the upper side (), and with a side surface, which connects the upper side () and the underside () and is provided as a mounting surface (), the package body () having a plurality of layers () which contain a ceramic material, and a main direction of extent of the layers () running obliquely in relation to the mounting surface (). Furthermore, a method for producing a package body () is provided.

Housing body and method for production thereof

A housing for an optoelectronic component comprises a housing body and first and second electrical terminal strips. The first and second terminal strips extend in part inside the housing body and are guided out of the housing body at a first side face. Outside the housing body the two terminal strips are bent in such a way that they comprise a first portion extending at an angle to the first side face, and a second portion () extending along and spaced from the first side face. A method for producing such a housing is also described.

Housing for an optoelectronic component

An optoelectronic component is specified that emits a useful radiation. It comprises a housing having a housing base body with a housing cavity, and a light-emitting diode chip arranged in the housing cavity. At least one base body material of the housing base body has radiation-absorbing particles admixed in a targeted manner to reduce its reflectivity. According to another embodiment of the component, the housing additionally or alternatively has a housing material transmissive for the useful radiation that has radiation-absorbing particles admixed in a targeted manner to reduce its reflectivity. In addition, a method for manufacturing such a component is specified.

Electromagnetic radiation emitting optoelectronic component and method for manufacturing an optoelectronic component

A package body () with an upper side (), with an underside (), opposite from the upper side (), and with a side surface, which connects the upper side () and the underside () and is provided as a mounting surface (), the package body () having a plurality of layers () which contain a ceramic material, and a main direction of extent of the layers () extending transversely in relation to the mounting surface (). Furthermore, a method for producing a package body () is provided.

Disclosed is a leadframe lot at least one electronic component, composing at least two electrical lead elements, each of which comprises at least one electrical lead tab and at least one retention tab. Provided between the at least one retention tab and the lead element is a score defining parallel offset between the retention tab and the adjacent region of the lead element. An additional parallel offset is defined between the lead element and the electrical lead tab, such that the retention tab and the electrical lead tab are located in a common plane. The score enables the retention tab to be removed easily without the need for a disadvantageous punched gap between the lead element and the retention tab.

Conductor frame for an electronic component and method for the production thereof

Optoelectronic component, having a basic body or housing (), at least one optoelectronic semiconductor chip () arranged in a recess of the basic body, and a potting composition () made of a transparent material, which potting composition embeds the at least one semiconductor chip in the recess, the transparent potting composition () being formed in diffusely scattering fashion and in particular containing diffuser particles () at which light impinging thereon is diffusely scattered.

Optoelectronic component

A surface-mountable light emitting diode structural element in which an optoelectronic chip is attached to a chip carrier part of a lead frame, is described. The lead frame has a connection part disposed at a distance from the chip carrier part, and which is electrically conductively connected with an electrical contact of the optoelectronic chip. The chip carrier part presents a number of external connections for improved conduction of heat away from the chip. The external connections project from a casing and at a distance from each other.

Surface-mountable light-emitting diode structural element

A housing is specified for an electronic component having at least two connecting parts (), which are partially in contact with the housing. The conductivity of at least subareas of the housing are set in a defined manner and current paths through the housing are formed between the connecting parts. The housing thus has a defined resistance (), which is connected in parallel with an electronic component (), and provides ESD protection for the component ().

Housing for an electronic component

A device () with a number of light emitting diode chips () in a reflector () is formed in such a way that the direct line of sight between the light emitting diode chips () is interrupted by a partition (). This improves the efficiency of the device () substantially.

Component comprising a large number of light-emitting-diode chips

Disclosed is a radiation emitting and/or receiving semiconductor component comprising at least one radiation emitting and/or receiving semiconductor chip (), which is disposed in a recess () of a housing base body () and is there encapsulated with an encapsulant () that is readily transparent to electromagnetic radiation emitted and/or received by the semiconductor chip (). The recess () comprises a chip well () in which the semiconductor chip () is secured, and a trench () that runs at least partway around the chip well () inside the recess (), such that between the chip well () and the trench () the housing base body () comprises a wall () whose apex, viewed from a bottom face of the chip well (), lies below the level of the surface of the housing base body () from which the recess () leads into the housing base body (), and the encapsulant () extends outward from the chip well () over the wall into the trench (). A corresponding housing base body is also disclosed.

Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component

A casting resin compound as an assembly and encapsulation material for electronic and optoelectronic component parts, modules and components, for example for casting out optoelectronic components on the basis of acid anhydride-curable epoxy compounds, particularly bisphenol A-diglycidyl ether, contains multi-functional epoxy novolak resins, particularly an epoxy cresol novolak. This casting resin compound exhibits a clearly increased glass transition temperature, is suitable for mass-production, exhibits no health deteriorations, and supplies SMT-capable products that can be utilized in the automotive sector.

Growing community of inventors

Bad Abbach, Germany

Karlheinz Arndt