Siemens Aktiengesellschaft

Osram Opto Semiconductors Gmbh

Epcos Ag

Infineon Technologies Ag

Siemens Aktiengesell Schaft

Snaptrack Incorporated

Karl Weidner

Walter Wegleiter

Axel Kaltenbacher

Bernd Barchmann

Ralph Wirth

Oliver Wutz

Jörg Zapf

Jan Marfeld

Norbert Seliger

Robert Weinke

Johann Ramchen

Harry Hedler

Alois Stelzl

Bert Braune

Herbert Schwarzbauer

Norbert Stath

Stefan Stegmeier

Georg Bogner

Stefan Illek

Wolfgang Pahl

Maximilian Fleischer

Jörg Erich Sorg

Jens Dahl Jensen

Henrik Ewe

Stefan Gruber

Georg Dirscherl

Juergen Moosburger

Jürgen Portmann

Thomas Licht

Eckhard Wolfgang

Frank Schremmer

Hans Wulkesch

Manfred Wossler

Michael Kaspar

Hans Kr&uuml;ger

Franz Auerbach

Hans-Juergen Hacke

Oliver Freudenberg

Jörg Naundorf

Matthias Rebhan

Wolfgang Radlik

Kerstin Wiesner

Markus Schieber

Jens-Christian Holst

Claus Reitlinger

Paola Altieri-Weimar

Gernot Schimetta

Ewald Karl Michael Günther

Kai Kriegel

Benjamin Sahan

Gerhard Mitic

Stefan Kiefl

Caroline Cassignol

Jörg-Erich Sorg

Friedrich Lupp

Andreas Peschka

Laurence Amigues

Andreas Franz

Michael Schiffer

Manfred Schreiner

Ladislaus Bittmann

Bernd Gutsmann

Ewald Gunther

Kerstin Häse

Ewald Günther

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, at least one side area connecting the top area and the bottom area; electrical contact locations at the top area or at the bottom area of the optoelectronic semiconductor chip; and a molded body, wherein the molded body surrounds the optoelectronic semiconductor chip at all side areas at least in places, the molded body is electrically insulating, and the molded body is free of any conductive element that completely penetrates the molded body.

Optoelectronic semiconductor component

A method of producing an optoelectronic semiconductor component includes providing a carrier; arranging at least one optoelectronic semiconductor chip at a top side of the carrier, wherein the semiconductor chip includes semiconductor layers deposited on a substrate; forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip and at least some of the layers deposited on the substrate are free of the shaped body such that these layers are not covered or completely exposed; and removing the carrier.

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, side areas connecting the top area and the bottom area, and epitaxially produced layers; electrical n- and p-side contacts at the bottom area of the optoelectronic semiconductor chip; and an electrically insulating shaped body, wherein the shaped body surrounds the optoelectronic semiconductor chip at its side areas, and the epitaxially produced layers are free from the shaped body.

The present invention relates to a module that has a lower component of a module () having a material () in which at least one first structural element () is embedded, and an upper component of a module () having a material () in which at least a second component () is embedded. The upper component of the module () and the lower component of the module () are stacked, with the lower and the upper component of the module () being electrically connected and mechanically linked to each other. In addition, the present invention relates to a simple and cost-effective process for the production of a variety of modules. The invention makes it possible for the modules to be miniaturized with respect to surface and height and/or makes it possible to achieve greater integration by 3D packaging.

Stacked modules

The present disclosure relates to power modules. The teachings thereof may be embodied in a power unit and/or a drive unit for driving the power unit, along with methods for producing a power module. For example, a power module may include: a power unit including a heat sink; a power device disposed on the heat sink; an insulating layer covering the heat sink and the power device; and a drive unit for driving the power unit, the drive unit comprising a contact element corresponding to the contact area of the power unit. An underside of the power unit is defined by an underside of the heat sink. A top side of the power unit is defined by a contact area thermally and/or electrically coupled to the power device and a surface of the insulating layer surrounding the contact area. The contact element may be disposed abutting the contact area of the power unit for making electrical and/or thermal contact with the power device.

Power module having power device connected between heat sink and drive unit

A method of producing an optoelectronic semiconductor component includes providing a carrier, arranging at least one optoelectronic semiconductor chip at a top side of the carrier, applying a phosphor layer at the at least one semiconductor chip, forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip, and removing the carrier, wherein the phosphor layer is applied before forming the shaped body.

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, and side areas connecting the top area and the bottom area; electrical contact locations at the top area or at the bottom area of the optoelectronic semiconductor chip; and an electrically insulating shaped body, wherein the optoelectronic semiconductor chip is a flip-chip having the electrical contract locations only at one side, either the underside or the top side, the shaped body surrounds the optoelectronic semiconductor chip at its side areas, and the shaped body is free of a via that electrically connects the optoelectronic semiconductor chip.

The invention relates to a device (), comprising at least one optoelectronic semiconductor component () and a substrate (), on which the semiconductor component is arranged, wherein an insulating layer () is adjacent to a lateral surface () that bounds the semiconductor component; a contact track () is arranged on a radiation passage surface of the semiconductor component and is connected to an electrically conductive manner to the semiconductor component; the contact track extends beyond the lateral surface of the semiconductor component and is arranged on the insulating layer; and the contact track is relieved with respect to a thermomechanical load occurring perpendicularly to the lateral surface.

Optoelectronic semiconductor device having contact track with relieved thermo-mechanical stress

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having side areas covered by a shaped body; at least one via including an electrically conductive material; and at least one electrically conductive connection electrically conductively connected to the semiconductor chip and the via, wherein the via is laterally spaced part from the semiconductor chip; the via includes a contact pin, the contact pin including an electrically conductive material; and the contact pin is laterally completely enclosed by the shaped body.

In at least one embodiment, the semiconductor component includes at least one optoelectronic semiconductor chip having a radiation exit side. The surface-mountable semiconductor component comprises a shaped body that covers side surfaces of the semiconductor chip directly and in a positively locking manner. The shaped body and the semiconductor chip do not overlap, as seen in a plan view of the radiation exit side.

Method for producing an optoelectronic semiconductor component, and optoelectronic semiconductor component

A micromechanical measuring element includes a carrier and a sensitive element connected to the carrier by a first solder connection and a second solder connection. The sensitive element is contacted electrically by the first solder connection. The sensitive element, the carrier and the second solder connection form a first chamber. The first chamber has a first opening.

Micromechanical measuring element and method for producing a micromechanical measuring element

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having side areas, a surface at a top side of the semiconductor chip, and a surface at a bottom side of the semiconductor chip; a shaped body having a surface at a top side of the shaped body and a surface at an underside of the shaped body; at least one plated-through hole including an electrically conductive material; and an electrically conductive connection electrically conductively connected to the semiconductor chip and the plated-through hole, wherein the side areas of the optoelectronic semiconductor chip are covered by the shaped body, and the surface at the top side and/or the surface at the bottom side of the optoelectronic semiconductor chip are completely free of the shaped body.

The invention relates to an optoelectronic semiconductor component, which has a carrier element (), on which an optoelectronic semiconductor chip () having at least one active layer is arranged, wherein the active layer is designed to emit or receive light during operation and wherein the semiconductor chip () is covered with a protective layer () that contains poly-para-xylenes.

An opto-electronic component has a carrier element () with a connection region (). Arranged on the carrier element () is a semiconductor chip (). A contact region () is mounted on the surface () of the semiconductor chip () remote from the carrier element (). The connection region () is electrically conductively connected to the contact region () by way of an unsupported conductive structure (). A method for manufacturing an opto-electronic component is described.

Optoelectronic component and method for producing an opto-electronic component

A chip () is arranged above a top side of a flexible support () and mechanically decoupled from the support. Electrical connections () of the chip are embodied using a planar connection technique. The chip can be separated from the support by an air gap or a base layer () composed of a soft or compressible material.

System support for electronic components and method for production thereof

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Munich, Germany

Karl Weidner