Motorola Corporation

Intel Corporation

Motrola, Inc.

Karl W Wyatt

Chao-pin Yeh

Wen Xu Zhou

Daniel Roman Gamota

Andrew Frederick Skipor

Jang-Hun (James) Yeh

Sean Xin Wu

Xinyu Dou

Gary K Mui

Samuel Anderson

Julio C Castaneda

Marc Kenneth Chason

John R Benham

Bo A Zhang

Chowdary Ramesh Koripella

Steven Michael Scheifers

John Critchlow

James J Morikuni

Matthew E Becker

Grace M O'Malley

Yinan Wu

Austin Vincent Harton

George Amos Carson

Neil Arthur Duffie

Mark E Naylor

John Bliss

Steven C Machuga

Terry L Rohde

Donald H Klosterman

Michelle J Morrell

Delbert Juarezl

Don Dillard

Kai X Hu

Xiaohua Wu

David Zak

Thomas G Wiegele

Welmin Sun

Dave Roller

Rich Dlesk

Tom Brey

A method and apparatus is described herein for pulse shift modulation of output waveforms for reducing crosstalk on interconnects. Based on input pulses/bits, an output waveform is selectively delayed by a shift value to ensure transitions in a first direction occur in a first half of a period and transitions in a second direction occur in a second half of the period. When the same pulse shift modulation is implemented on surrounding traces, certain worst-case crosstalk scenarios are reduced; thus reducing crosstalk and increasing performance in power consumption and speed of data transfer.

Pulse shift modulation for reducing cross-talk of single ended I/O interconnects

According to an embodiment of the invention, a method and apparatus for signal modulation are described. According to an embodiment of the invention, a method comprises producing and transferring a modulated signal. The modulation of the signal is over a plurality of amplitude levels, including at least a first amplitude level, a second amplitude level and a third amplitude level, and over a plurality of time slots, including at least a first time slot, a second time slot, and a third time slot. The modulated signal transitions from the first amplitude level to the second amplitude level in the first phase slot, remains at the second amplitude level in the second time slot, and transitions from the second amplitude level to the third amplitude level in a third time slot.

Signal modulation

A connector is configured for insertion and removal of a digital device. The connector has contacts arranged to make electrical connection to conductors on the digital device while the digital device is inserted in the connector. A first electromagnetic coupler is connected to at least one of the contacts of the connector. The electromagnetic coupler is configured for electromagnetic coupling at an interface to a second electromagnetic coupler that is connected to a communication bus.

Electromagnetic bus coupling

The method (400, 500) and device (200) for reworkable direct chip attachment include a thermal-mechanical and mechanical stable solder joint for arranging connection pads on a top surface of the circuit board to facilitate connection for electronic elements, and affixing a reinforcement having apertures to accommodate solder joints to the top surface of the circuit board to facilitate solder attachment of the connection pads to the electronic elements wherein the reinforcement constrains deformation of the circuit board to provide reliable solder joints and facilitates attachment and removal of electronic elements from the circuit board.

Device for reworkable direct chip attachment

A microelectronic assembly (10) includes an integrated circuit die (12) that is mounted to a printed circuit board (14). The integrated circuit die (12) overlies the printed circuit board (14) and includes an active face (26) that faces the printed circuit board (14) and is spaced apart therefrom by a gap (30). A plurality of solder bump interconnections (32) extend across the gap (30) and connect a plurality of board bond pads (22) with a plurality of die bond pads (28). A polymeric precursor (13) is dispensed onto the printed circuit board (14) about the integrated circuit die (12) and is curable to form a polymeric encapsulant (16). The polymeric precursor (13) is drawn into the gap (30) and forms a fillet (34) overlying the printed circuit board (14). A frame (18) is embedded in the fillet (34), not in direct contact with the board (14), and the polymeric precursor (13) is heated to cure the polymeric precursor (13) to form a polymeric encapsulant (16). The frame (18) is affixed to the printed circuit board (14) within the polymeric encapsulant (16) to provide increased mechanical strength for the microelectronic assembly (10).

Frame embedded in a polymeric encapsulant

The present invention provides a method, article of manufacture, and optical package (24) for eliminating tilt angle (40) between an optical emitter (26) mounted on a carrier (28). The method, article of manufacture, and optical package (24) include a carrier (28) having a top surface (42) with a cavity (46) formed therein, an adhesive material (38) inserted into the cavity (46), and an optical emitter (26) placed on the top surface (42) of the carrier (28) and at least partially covering the cavity (46), thereby providing at least one egress point for overflowing said adhesive material therefrom.

Method, article of manufacture, and optical package for eliminating tilt

The present invention provides a low cost, efficient vertical cavity surface emitting laser package (300) and manufacturing method, the package having a head assembly having at least three leads, a vertical cavity surface emitting laser die bonded to a top surface of the head assembly, for generating a beam of light, and a photodiode, die bonded to the top surface of the head assembly proximate to the vertical cavity surface emitting laser for receiving at least a portion of the beam of light, and generating feedback for adjusting an electrical input current to the vertical cavity surface emitting laser based on a received optical power of the portion of the beam of light received. The vertical cavity surface emitting laser and the photodiode are injection molded in a predetermined shape with a recessed area for placement of a partially reflective holographic optical element/reflector.

Low cost, efficient vertical cavity surface emitting laser package,

The present invention provides a method (600) and device (200,500) for providing temperature-stable optical feedback for optical packages. The device includes an optical emitter (202,502), a first partially reflective optical element (204, 504), a second partially reflective optical element (206,506), a first optical sensing unit (208,508), a second optical sensing unit (210,510), and a feedback unit (212). The optical emitter (202,502) is responsive to an electrical input current and generates a beam of light (214). The first optical sensing unit (208,508) and the second optical sensing unit (210,510) receive diffracted portions of the beam of light (214) from the first partially reflective optical element (204, 504) and the second partially reflective optical element (206,506) respectively and generate a first feedback signal E1 and a second feedback signal E2. The feedback unit (212) utilizing the first feedback signal E1 and the second feedback signal E2 adjusts the electrical input current to the optical emitter (202,502).

Method and device for providing temperature-stable optical feedback for

The present invention provides a method (600) and device (400) for minimizing wind-induced noise in a microphone. The device includes: a housing (412) having a recessed area shaped to accommodate a microphone transducer (410); the microphone transducer (410), situated within the recessed area such that a thin film situated over the microphone transducer is flush with/overlaying a top of the recessed area and affixed at least to the sides of the recessed area, for receiving sound; and the thin film (402) has at least one aperture (404, . . . 406) for allowing sound to impinge on the microphone transducer (410), and has a minimal thickness that maintains structural integrity.

Flush-porting method and device for reduction of wind-induced noise in a

A microelectronic assembly (10) includes an integrated circuit die (12) mounted onto a substrate (14) by solder bump interconnections (32). The die (12) and the substrate (14) are spaced apart by a gap (30) that is filled with a polymeric encapsulant (16). The die (12) includes a die perimeter (24) and a face (27) facing away from the substrate (14). A polymeric reinforcement (18) is disposed onto the die face (27) to protect the die (12) and to reduce the effects of thermally induced stresses on the die (12) and the solder bump interconnections (32). The polymeric reinforcement (18) is spaced apart from the die perimeter (24) to maintain a desired peripheral fillet geometry of the encapsulant (16).

Microelectronic assembly including polymeric reinforcement on an

A micro-turbo generator device (10) includes a housing (12), a rotor (14), a plurality of stator cores (16), and coils (18) encircling the stator cores. The housing (12) includes a shaft (34) which has an axis (11). The rotor (14) is rotatably mounted onto the shaft (34) and includes a perimeter (32) and a plurality of rotor poles (24) extending generally radially about the axis (11). Each rotor pole (24) includes a magnetizable tip (30) and a concave fluid impact surface (26). The stator cores (16) are disposed about the rotor (14) and include first pole face (15) and second pole face (17) facing the perimeter (32) of the rotor (14) and spaced apart therefrom. The coils (18) helically encircle the stator cores (16) and conduct electrical current to magnetize the stator cores (16) to magnetize the tips (30) and to alternately conduct induced electrical current generated in response to changes in magnetic flux between the first and second pole faces (15, 17) and the magnetizable tips (30).

Micro-turbo generator device

Board delamination during the singulation from a board panel and board sagging during front-end assembly are two biggest problems encountered in cellular manufacturing lines. The method (700) and circuit board panel (600) of the present invention substantially eliminate assembly-line delamination and sagging for circuit board manufacturing. A number of slots are punched to fit into a circuit board profile. V-grooves are cut along each of the circuit board profiles through the slots and directly opposite on a top and bottom of the circuit board. Thus, optimization of the cut-outs and v-groove configurations eliminate tearing/delamination and substantially reduce sagging.

Method and circuit board panel for circuit board manufacturing that

The present invention provides a manufacturing process (600) and method (500) for efficiently providing a multi-holographic optical element substrate unit. Upon preparation of an original continuous/non-continuous holographic optical element with uniform diffraction efficiency and marking the original continuous/non-continuous holographic optical element with predetermined alignment marks, the original continuous/non-continuous holographic optical element is cut into a predetermined number of individual holographic optical elements in accordance with the predetermined alignment marks. Then a substrate is prepared with alignment marks in accordance with the predetermined alignment marks of the individual holographic optical elements, and the individual holographic optical elements are attached to a substrate in accordance with the alignment marks.

Hologram manufacturing process and method for efficiently providing a

An optical isolator (10) includes an opto-electronic emitter (16) and an opto-electronic detector (17) mounted over offset portions (12, 13) of a leadframe (11). The offset portions (12, 13) form angles (14, 15) with other portions (24, 25) of the leadframe (11). An optically transmissive material (22) encapsulates the opto-electronic emitter (16) and the opto-electronic detector (17), and a reflective material (20) is located above the opto-electronic emitter (16) and the opto-electronic detector (17). An optically insulative packaging material (26) encapsulates the optically transmissive material (22).

Optical isolator having leadframe with non-planar mounting portions

A portable fuel cell device (10) includes a fuel reservoir (26) and an oxidant chamber (34). Gaseous fuel from the fuel reservoir (26) is mixed with an oxidant from the oxidant chamber (34) by an aspirator (42) to form a fuel-oxidant mixture. The fuel-oxidant mixture is passed through a fuel-oxidant line (44) into a fuel cell (13). The fuel cell (13) contains a reaction chamber (20) that generates electricity by reacting the fuel-oxidant mixture. Waste gaseous products, such as water and carbon dioxide, are sent through an exhaust line (24) to a water trap (46). The water trap (46) contains a water absorbing medium (52) for absorbing the water vapor from the exhaust gas, thereby forming a dry exhaust gas. The dry exhaust gas is released through the exhaust vent (48) into the ambient atmosphere.

Growing community of inventors

Cary, IL, United States of America

Karl W Wyatt