Chrysler Corporation

Daimlerchrysler Corporation

Karl W Shock

Paul A Markow

Bradley S Chupp

Frank R Holmes

Luis Juan Morenilla

Terry P Mach

Stephen W Burcham

Rick Yohman

Chris Martin

Joe R Morton

A text fixture for testing a transfer case electronic control unit according to this invention comprises an eletro-mechanical shift mechanism having electronic inputs and outputs for coupling to electronic inputs and outputs output of the transfer case electronic control unit and an output shaft coupled to a transfer case load simulator. In a preferred embodiment, the transfer case load simulator comprises first and second oppositely wound torsion springs having identical torque characteristics coupled in opposed relation to the output shaft of the eletro-mechanical shift mechanism.

Transfer case controller test fixture

A heat sink assembly to remove heat from electrical components mounted on a circuit board is disclosed. The assembly contains a housing that is formed from a suitable heat sinking material and is appropriate for receiving a circuit board with surface mounted electrical components. The invention provides an improved apparatus for establishing thermal contact from a heat generating, surface mounted electrical component to the housing. A resilient biasing element is fixed in relation to the circuit board and the housing in order to urge the circuit board with a plurality of surface mounted electrical components in thermal contact with the housing. Once the heat sink is assembled the invention provides various means for which heat can be readily transferred from the electrical components to the housing. Heat can be transferred away from the electrical component to the housing through a thermal via incorporated within the circuit board, though the resilient biasing element, or by direct contact of the electrical component and the housing.

Heat sink assembly for electrical components

A heat sinking module cover for use with a potted electronic module assembly is disclosed. An electronic module assembly contains heat generating electrical components. Typically the electrical components are held in relation to a module housing. The module housing, generally, not only provides support but also acts as a heat sink for heat generating electrical components. The electrical components are covered by a potting compound. The potting compound protects the electrical components from dust or any other particles that could affect the function of the electrical component. The present invention discloses a heat sinking module cover with a support portion and a thermal transfer portion. The heat sinking module cover is positioned with respect to the module housing to form a box-like structure. The thermal transfer portion contacts the potting material directly to provide an additional heat sinking means for the electronic module assembly.

Heat sinking module cover

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Madison, AL, United States of America

Karl W Shock