Endress+hauser Gmbh+co. Kg

Other

Karl-Peter Hauptvogel

Dietmar Birgel

Sergej Lopatin

Alexander Müller

Wolfgang Brutschin

Roland M&uuml;ller

Thomas Malzahn

Andreas Kiefer

Dietmer Birgel

Klaus Peter Weinhold

Paul Burger

Andreas Bensch

Herbert Harder

Alexander MÜLLER

In order to secure wired components of large mass or non-uniform mass distribution safely on a circuit board, without the components needing, as currently usual, to be glued onto the circuit board or held on the circuit board with snap-in holders, integrated into a connection bore for receiving a connection wire, or pin, of an electronic component a holding mechanism for secured holding of the connection wire, or pin. The holding mechanism represents a narrowing in the connection bore to a diameter smaller than that of the connection wire, or pin. The holding mechanism can be implemented, for example, by a connection bore embodied in the form of a bore drilled from one side of the circuit board, not completely through the circuit board. In such case, edge remains as a narrowing, which securely seizes the connection pin of the relevant component and holds the component fixed to the circuit board.

Circuit board with holding mechanism for holding wired electronic components method for manufacture of such a circuit board and their use in a soldering oven

An electromechanical transducer with at least one piezoelectric element with a first surface on which a first electrode is applied, and at least one contact flag, through which the piezoelectric element is electrically connected. The electrical connection of the piezoelectric element is of very high contact reliability, in that the contact flag directly contacts the first electrode and exhibits at least one depression, into which an adhesive is placed, by which the contact flag is connected with the electrode.

Electromechanical converter comprising at least one piezoelectric element

A circuit board with a contact sleeve mounted thereon. The contact sleeve is electrically connectable in the manner used for an SMD-component. An upper side of the circuit board has a recess and a metallizing bordering the recess, the metallizing being connected to a conductor path extending on the circuit board, and, set in the recess, a contact sleeve, which is both mechanically secured and electrically connected to the metallizing by means of a solder connection.

Printed circuit board comprising a contact sleeve that is mounted thereon

This circuit board contains electronic components having electrical contacts. At least one of the electrical contacts is initially glued to the circuit board using a conductive adhesive and at least one of the electrical contacts is connected to the circuit board by soldering. The circuit board is suitable for fast mechanical mass production. Further a method for the manufacture of the connection between the circuit board and the electronic components is disclosed, in which a solder is applied to soldering points and a conductive adhesive is applied to adhesive points. The circuit board with the components is then placed in a furnace to connect the components to the circuit board.

Circuit board with an electronic component and a method for producing a connection between the circuit board and the component

The invention relates to a device (,) for determining the filling level in a container (,). Moreover, the invention also relates to a method for fastening an input coupling unit (,) on the antenna (,), the antenna (,) being used in the device (,) according to the invention. It is the object of the invention to provide overvoltage protection for an antenna (,), and a method for producing such an antenna (,). The object is achieved by virtue of the fact that the antenna (,) comprises at least two dielectric layers (,). The first dielectric layer (,) has at least one cutout (,) for holding the input coupling unit (,). The second dielectric layer (,) bears an antenna structure (,) on the side facing the first dielectric layer (,) and has a conductive coating (,) with openings (,) on the side averted from the first dielectric layer (,). Contacts (,) are provided in the second dielectric layer (,) and the conductive layer (,) which connect the input coupling unit (,) to the conductive coating (,). The region of space defined by the contacts (,), the conductive coating (,) and the antenna housing (,) forms a Faraday cage.

Device for determining the filling level of a filling material in a container

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Bartenheim, France

Karl-Peter Hauptvogel