Epcos Ag

Karl Nicolaus

Hans Krueger

Jürgen Portmann

Wolfgang Pahl

Alois Stelzl

Anton Leidl

Gregor Feiertag

Peter Selmeier

Christian Siegel

Juergen Portmann

Robert Eichinger

Thomas Wassner

Thomas Sedlmeier

The present invention relates to a method for producing a sensor (SEN), comprising the steps of arranging a sensor element (SE) on a carrier (TR), arranging a cover (AF) on the sensor element (SE), wherein the sensor element (SE) is enclosed between the cover (AF) and the carrier (TR), adhesively bonding a carrier film (TF) onto the cover (AF), and producing an opening (SO) in the carrier film (TF) and the cover (AF), wherein the openings (SO) in the carrier film (TF) and the cover (AF) at least partly overlap.

Method for producing a sensor

A component includes a carrier substrate having a coefficient of thermal expansion &#x3b1;and a chip mounted on the carrier substrate by a plurality of bumps. The chip has a first coefficient of thermal expansion &#x3b1;in a first direction xand a first expansion difference, &#x394;&#x3b1;equal to the absolute value of &#x3b1;&#x2212;&#x3b1;. The chip also has a second coefficient of thermal expansion &#x3b1;in a second direction xand a second expansion difference &#x394;&#x3b1;is equal to the absolute value of &#x3b1;&#x2212;&#x3b1;,. The bumps are arranged such that a first distance, &#x394;x, corresponding to a normal projection of a line between centers of terminally situated bumps in the first direction onto an axis running parallel to direction xis less than a second distance corresponding to a normal projection of a line between centers of terminally situated bumps in the second direction onto an axis parallel to direction x.

Electric component with a flip-chip construction

The present invention relates to an encapsulated component that includes a carrier substrate and at least one chip positioned on the top of the carrier substrate and electrically connected to it by means of electrically conductive connections. The encapsulation of the chip is accomplished with a seal or dielectric layer. As a result of differing coefficients of expansion of the seal or dielectric layer and the electrically conductive connections, with changing temperatures stresses occur in the electrically conductive connections, which can lead to cracks, breaks and even to interruption of the electrically conductive connections. To mechanically relieve the electrically conductive connections of stresses from changing temperatures (in particular under extreme thermal loads), it is proposed that the carrier substrate be provided with a support element that encircles the chip, which serves to support the seal or dielectric layer, and/or that the material and the arrangement of the encapsulation be selected accordingly.

Encapsulated electronic component and production method

Growing community of inventors

Munich, Germany

Karl Nicolaus