Infineon Technologies Ag

Karl Mayer

Francisco Javier Santos Rodriguez

Michael Roesner

Rainer Leuschner

Manfred Engelhardt

Bernhard Goller

Gudrun Stranzl

Evelyn Napetschnig

Stefan Woehlert

Martin Zgaga

Michael Sternad

Michael Pinczolits

Srinivasa Reddy Yeduru

Karl Heinz Gasser

Hermann Wendt

Ravi Keshav Joshi

Alexander Breymesser

Thomas Christian Neidhart

Vijaye Rajaraman

Kamil Karlovsky

Peter Zorn

Guenter Zieger

Christian Krenn

Marco Koitz

Monika Cornelia Voerckel

Bernhard Boche

Franz Kleinbichler

Bernd Noehammer

Christine Moser

Guenther Zoth

A system and method for manufacturing a packaged component are disclosed. An embodiment comprises forming a plurality of components on a carrier, the plurality of components being separated from each other by kerf regions on a front side of the carrier and forming a metal pattern on a backside of the carrier, wherein the metal pattern covers the backside of the carrier except over regions corresponding to the kerf regions. The method further comprises generating the component by separating the carrier.

Component and method of manufacturing a component using an ultrathin carrier

Methods for processing a semiconductor workpiece can include providing a semiconductor workpiece that includes one or more kerf regions; forming one or more trenches in the workpiece by removing material from the one or more kerf regions from a first side of the workpiece; mounting the workpiece with the first side to a carrier; thinning the workpiece from a second side of the workpiece; and forming a metallization layer over the second side of the workpiece.

Methods for processing a semiconductor workpiece

A method for processing a wafer in accordance with various embodiments may include: removing wafer material from an inner portion of the wafer to form a structure at an edge region of the wafer to at least partially surround the inner portion of the wafer, and printing material into the inner portion of the wafer using the structure as a printing mask. A method for processing a wafer in accordance with various embodiments may include: providing a carrier and a wafer, the wafer having a first side and a second side opposite the first side, the first side of the wafer being attached to the carrier, the second side having a structure at an edge region of the wafer, the structure at least partially surrounding an inner portion of the wafer; and printing material onto at least a portion of the second side of the wafer.

Method for processing a wafer and wafer structure

A lithium ion battery includes a first substrate having a first main surface, and a lid including an insulating material. The lid is attached to the first main surface of the first substrate, and a cavity is defined between the first substrate and the lid. The lithium ion battery further includes an electrical interconnection element in the lid, the electrical interconnection element providing an electrical connection between a first main surface and a second main surface of the lid. The lithium ion battery further includes an electrolyte in the cavity, an anode at the first substrate, the anode including a component made of a semiconductor material, and a cathode at the lid.

Lithium ion battery, integrated circuit and method of manufacturing a lithium ion battery

The various aspects comprise methods and devices for processing a wafer. An aspect of this disclosure includes a wafer. The wafer comprises a plurality of die regions; a plurality of kerf regions between the plurality of die regions; and a metallization area on the plurality of die regions.

Utilization of a metallization scheme as an etching mask

In various embodiments, a method of processing a contact pad may include providing a contact pad, a topmost layer of the contact pad containing aluminum or an aluminum alloy, at least part of the topmost layer of the contact pad being exposed; subjecting the contact pad to a thermally activated atmosphere containing water or reactive components of water.

Method of processing a contact pad

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Villach, Austria

Karl Mayer