Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag

Karl Kobler

Hanifi Malcok

Holger Lundt

Hermann Zwirglmaier

A method for monitoring the calibration of and calibrating rotating tools ich are liable to deviate, wherein at least one known deviation is recorded at a first predetermined rotational speed. The method can be used with annular saws that divide workpieces into semiconductor wafers.

Method for calibrating rotating tools

A method and an apparatus are for machining semiconductor material with a inding tool while feeding a liquid cleaning agent to the working surface of the grinding tool, has the cleaning agent being exposed to sound waves having a specific frequency and having a specific intensity. In one embodiment of the method, the cleaning agent is exposed to sound waves in at least one nozzle and then the cleaning agent is directed against the working surface of the grinding tool. In another embodiment, the cleaning agent is guided through at least two cleaning agent jets against the working surface of the grinding tool, which cleaning agent jets differ from each other in that they are exposed to sound waves of different frequencies.

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Mattighofen, Austria

Karl Kobler