Novellus Systems Incorporated

Speedfam-ipec Corporation

Speedfam Corporation

Karl Kasprzyk

Thomas Laursen

Justin M Quarantello

Paul Franzen

Isao Nagahashi

Thomas Waddle

Steven Reynolds

Rob Stoya

Methods are provided for chemical mechanical planarization of a layer and for determining the endpoint of a CMP operation. In accordance with one embodiment the method for determining an endpoint comprises making a plurality of eddy current thickness measurement of the layer being planarized, each of the plurality of measurements spaced apart by a predetermined length of time. A difference is calculated between sequential ones of the plurality of eddy current measurements, and a predetermined minimum threshold for the difference is set. The endpoint is defined as a calculated difference less than the predetermined minimum threshold.

Methods for chemical mechanical planarization and for detecting endpoint of a CMP operation

Methods are provided for monitoring a CMP process. An exemplary method comprises generating a plurality of thickness measurements of a metal layer using an in-situ eddy current measuring system. The thickness measurements are analyzed to derive a plurality of work piece metrics and the work piece metrics are assessed to determine if a predetermined number is within a predetermined specification. A signal is generated if the predetermined number of the work piece metrics is outside the predetermined specification.

Methods for monitoring a chemical mechanical planarization process of a metal layer using an in-situ eddy current measuring system

A plate stabilizing apparatus is provided which comprises a lateral support structure conflgured to adjust plate alignment which engages vertical rails secured to a polishing machine housing. thus effectively stabilizing the polishing plate while allowing vertical movement of the plate assembly. In a preferred embodiment, a plate stabilizing apparatus includes an alignment plate secured to a subcylinder close to and axially aligned with the polishing plate universal joint. Adjustment screws are provided for lateral adjustment of the polishing plate which is secured to a substantially rigid lateral support structure. The lateral support structure rides within vertical rails secured to the inner housing walls of the polishing apparatus thus allowing vertical movement of the polishing plate during operation.

Methods and apparatus for polishing using an improved plate stabilizer

In a polishing machine for polishing parts between a table and an upper polishing head, the upper polishing head includes push rods to clear the workpieces after a polishing operation. A push ring engages the push rods as a polishing head is being raised, holding the workpieces in position on the table.

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Gilbert, AZ, United States of America

Karl Kasprzyk