International Business Machines Corporation

Invensas LLC

Karl J Puttlitz, Sr

Peter Jeffrey Brofman

Kathleen Ann Lidestri

Mark Vincent Pierson

Craig G Heim

Russell H Lewis

James Gardner Ryan

Sudipta Kumar Ray

Shaji Farooq

Kamalesh K Srivastava

Raymond A Jackson

Erick G Walton

William Edward Sablinski

Birendra N Agarwala

Paul A Totta

Arthur Bross

Gregg B Monjeau

Nicholas G Koopman

Aziz M Ahsan

Balaram Ghosal

Adolf E Wirsing

Joseph G Schaefer

Li-Chung Lee

Mark F Chadurjian

Andrew J Downing

Donald C Foster

Marie Angelopoulos

Jeffrey Donald Gelorme

Da-Yuan Shih

Jane M Shaw

Sung Kwon Kang

Mario John Interrante

Lewis Sigmund Goldmann

Donald W Henderson

Ali Afzali-ardakani

Harvey Charles Hamel

Michael Berger

Charles C Goldsmith

Horatio Quinones

Thomas P Moyer

Jack A Dickerson

Timothy A Gosselin

Keith F Beckham

Karl Schink

Herbert Wenskus

Thomas Baird Pillsbury

Robert H Meyen

Kathleen M McGuire

Anne E Kolman

Won K Choi

Marlene W Moyer

Sung K Kang

A solder composition and associated method of formation. The solder composition comprises a substantially lead-free alloy that includes tin (Sn), silver (Ag), and copper. The tin has a weight percent concentration in the alloy of at least about 90%. The silver has a weight percent concentration X in the alloy. X is sufficiently small that formation of Ag Sn plates is substantially suppressed when the alloy in a liquefied state is being solidified by being cooled to a lower temperature at which the solid Sn phase is nucleated. This lower temperature corresponds to an undercooling &dgr;T relative to the eutectic melting temperature of the alloy. Alternatively, X may be about 4.0% or less, wherein the liquefied alloy is cooled at a cooling rate that is high enough to substantially suppress Ag Sn plate formation in the alloy. The copper has a weight percent concentration in the alloy not exceeding about 1.5%.

Lead-free tin-silver-copper alloy solder composition

An electrical connector arrangement for connecting electronic devices to one another. The connector arrangement uses tensile members and compression members, at least the tensile members of which act to provide both an electrical connection between electronic devices and force over a range of distances to hold the devices together. The tensile members provides tensile force acting to hold the electronic devices together while the compression members provide an opposing compressive force over a range of distances which balances the tensile force to thereby form a cellforce connector used to connect an array of electrical contact points on one electronic device to a corresponding array of electrical contact points on another electronic device.

Mechanical attachment means used as electrical connection

Apparatus for connecting a first area array component to a substrate with a joining material. The apparatus has a nozzle directing heat toward both the first area array component and the portion of the substrate beneath the first area array component to melt the joining material. An elastic seal contacts the substrate and prevents the heat from affecting other components adjacent the first area array component. The nozzle is pressed against the substrate to restrain warping of the substrate, which might be caused by the heating of the first area array component, and to prevent damage to the substrate. The nozzle can tilt so that it conforms to the surface of the substrate. The first area array component is allowed to move freely in the direction of a plane of the substrate under the surface tension of the molten joining material during heating to center the first area array component.

Apparatus for manufacturing circuit boards

An electronic component having a socketable bump grid array comprising shaped-solder coated metallic spheres is provided by a method which comprises positioning solder coated metal spheres in an aligning device having a plurality of openings corresponding to the array, the openings being tapered preferably in the form of a truncated cone with the base of the cone being at the upper surface of the aligning device and having a diameter larger than the diameter of the solder coated metal sphere. The opening is configured so that a sphere positioned in the opening extends partially above the upper surface of the aligning device. The pads of the substrate are then contacted with the positioned spheres and, when the solder is reflowed, the solder forms a bond between the conductive layer on the substrate in contact with the solder-coated metal sphere and takes the shape of the aligning device and which maintains a solder coating on the whole surface of the metal sphere. An apparatus is also provided for making such a socketable bump grid array.

Socketable bump grid array shaped-solder on copper spheres

System for replacing a first area array component connected to an

An electronic component having a socketable bump grid array comprising shaped-solder coated metallic spheres is provided by a method which comprises positioning solder coated metal spheres in an aligning device having a plurality of opening corresponding to the array, the openings being tapered preferably in the form of a truncated cone with the base of the cone being at the upper surface of the aligning device and having a diameter larger than the diameter of the solder coated metal sphere. The opening is configured so that a sphere positioned in the opening extends partially above the upper surface of the aligning device. The pads of the substrate are then contacted with the positioned spheres and, when the solder is reflowed, the solder forms a bond between the conductive layer on the substrate in contact with the solder-coated metal sphere and takes the shape of the aligning device and which maintains a solder coating on the whole surface of the metal sphere. An apparatus is also provided for making such a socketable bump grid array.

A method for producing interconnect structures and circuit boards including placing an area array component having connection bumps on the corresponding metal contacts on a substrate disposed on a backing plate, providing heat curable joining material in communication with the bumps and contacts, contacting a gas nozzle directly to a portion of the substrate surrounding the component to press the substrate between the nozzle and the backing plate to restrain the substrate from wrapping, heating the component, the joining material and the substrate proximate the metal contacts while maintaining the nozzle on the substrate to cure the joining material, and cooling the component, the joining material and the substrate. Selected components can also be replaced utilizing the gas nozzle for restraining the substrate from wrapping.

Method for restraining circuit board warp during area array rework

Electrically conductive and abrasion resistant polymeric compositions, methods of fabrication thereof and uses thereof are described. Admixtures of abrasion resistant materials and electrically conductive polymeric materials are formed. Many of these admixtures are light transmitting and can be used as an abrasion resistant light transmitting electrostatic discharge layers. The light transmitting discharge layer is useful as a surface coating for visual displays such as CRT screens to avoid electrostatic accumulation of dust and scratching. The compositions can be admixtures of abrasion resistant silicones, polysiloxanes, acrylates, epoxies, methacrylates, epoxyacrylates, epoxymethacrylates, styrenes and electrically conductive polymers selected from the group of substituted and unsubstituted polyanilines, polyparaphenylenevinyles, substituted and unsubstituted polythiophenes substituted and unsubstituted poly-p-phenylene sulfides, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophenes, polyacetylines formed from soluble precursors, combinations thereof and blends thereof with other polymers. The compositions can be a layer of an electrically conductive polymer with an abrasion resistant layer thereover.

Electrically conductive and abrasion/scratch resistant polymeric

The present invention relates generally to a new apparatus and method for removing solid material and liquid material that may contain solid material from a substrate. More particularly, the invention encompasses an apparatus and method for removing molten solder which may contain solid particles and solder balls or columns from a substrate using a unique squeegee. Also, disclosed is a method for removing solder balls or columns from a substrate using a backer having an adhesive thereon.

Apparatus and method for removing meltable material from a substrate

Method for removing meltable material from a substrate

A porous metal block for selectively removing solder or braze from a substrate is disclosed. The block comprises a plurality of protrusions which absorb solder or braze through capillary action. The number and dimensions of the protrusions vary depending on the application. Also disclosed is a process for making such a block involving a unique two steps sintering process.

Porous metal block for removing solder or braze from a substate and a

The present invention relates generally to a new interconnection and a method for making the same, and more particularly, to an elongated solder interconnection and a method for making the same. On an electronic carrier, a pad is formed on which a solder mass is deposited and capped with a metal layer, thereby forming an elongated solder interconnection. A further elongated solder interconnection can now be formed by forming a second solder mass on the first solder mass that has been capped by a metal layer. Additional elongated solder interconnection can be formed by capping the preceding solder mass and/or the last solder mass with a metal capping layer. Alternatively, the encapsulating layer can be in the form of a sidewall spacer formed on the sidewalls of the solder mass.

Method of forming dual height solder interconnections

Process of making a porous metal block for removing solder or braze

Solder mass having conductive encapsulating arrangement

An improved solder interconnection for forming I/O connections between an integrated semiconductor device and a support substrate having a plurality of solder connections arranged in an area array joining a set of I/O's on a flat surface of the semiconductor device to a corresponding set of solder wettable pads on a substrate, the improvement being a band of dielectric organic material disposed between and bonded to the device and substrate embedding at least an outer row of solder connections leaving the center inner solder connections and the adjacent top and bottom surfaces free of dielectric material.

Solder interconnection structure for joining semiconductor devices to

Growing community of inventors

Wappingers Falls, NY, United States of America

Karl J Puttlitz, Sr