Heraeus Sensor Technology Gmbh

Heraeus Electro-nite International N.v.

Karl-Heinz Wienand

Karlheinz Ullrich

Matthias Muziol

Thomas Loose

Armin Lotz

A flow sensor element is provided having at least one temperature-measuring element and at least one heating element each having at least one platinum thin film resistor, the at least one temperature-measuring element and the at least one heating element each being arranged on a carrier element which is formed from a ceramic foil laminate or a multi-part ceramic component. The carrier elements have electrical conductor paths and junction surfaces for electrically contacting the at least one temperature-measuring element and the at least one heating element. The at least one temperature-measuring element and the at least one heating element each have a metallic carrier foil with an electrically insulating coating, on which the platinum thin film resistors are arranged. The flow sensor element may be used for mass through-flow measurements of gaseous or liquid media in pipe ducts, for example in an exhaust gas pipe of an internal combustion engine.

Flow sensor element and method of using same

A temperature sensor is provided with a temperature-sensitive element on a surface of a monocrystalline substrate, wherein the temperature-sensitive element is made of a platinum thin-film resistor and is produced as an epitaxial layer. The monocrystalline substrate can be an electrically insulating material, preferably &agr;-Al O or MgO. Alternatively, the substrate may be an electrically conducting material, such as silicon, with an electrically insulating epitaxial layer arranged between the substrate and the platinum thin-film resistor. The platinum thin-film resistor epitaxial layer is preferably deposited by physical vapor deposition (PVD), chemical vapor deposition (CVD), or molecular beam epitaxy (MBE).

Temperature sensor

A semiconductor component with an integrated circuit has a cooling body as a heat sink and a temperature sensor thermally connected thereto, whose resistance is dependent on temperature. The temperature sensor contains a thin film measuring resistor, which is applied to an electrically insulating surface of a foil-like substrate, and the total thickness of the temperature sensor lies in a range of about 10 &mgr;m to 100 &mgr;m. The thin film measuring resistor is formed as a planar component, with the temperature sensor being arranged between the integrated circuit and the cooling body. The thin film measuring resistor is provided on one side with a thermal coupling layer bordering on the cooling body, while on the other side the resistor has a substrate bordering on a heat distributor, which at least partially surrounds the integrated circuit.

Semiconductor component with integrated circuit, cooling body, and temperature sensor

For detecting the temperature of a fluid, particularly a flowing liquid or gaseous medium, in the hollow space of a housing, a temperature-measuring element is provided that can be connected to an evaluation device via a plug arrangement and is arranged in a protective tube of a sensor housing, which is closed on one side, and with a connection piece firmly affixed thereto. The protective tube projects at least with its tip into an opening of the hollow space that is sealed off from the outside atmosphere using an elastic O-ring. The temperature-measuring element is arranged in the region of the tip of the protective tube on one end of a longitudinally extending circuit board and is connected via strip conductors to the plug arrangement that leads to the outside. The plug arrangement is surrounded by a screw sheath of the sensor housing, which is firmly connected to the protective tube and is provided with a threading that projects into the housing of the hollow space for the purpose of mounting.

Sensor for detecting the temperature of a fluid

In order to connect contact surfaces of electric component blanks for layer resistors to at least two elongated, metallic connection leads, elongated, slot-shaped openings are made, e.g., by etching, in a continuous metal sheet to manufacture a connection lead blank. The openings border on later connection leads of the connection blank and cross-struts yet to be removed. In a second step, the connection lead blank is brought into a cassette and seized, whereby one of the cross-struts projects out of the cassette and is separated in a third step, such that the free ends of the parallel-running connection leads project out of the cassette. In a fourth step, the cassette is brought into a bonding or welding device, so that the free ends of the connection leads cover the contact surfaces of a component blank or a multi-component blank and are connected together by a bonding or welding operation. In case a multi-component blank (multi-unit plate) is used, it is then separated into individual components. Proving to be advantageous are a high corrosion resistance (up to 750&deg; C.) and the possibility of largely automated manufacturing and further processing.

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Aschaffenburg, Germany

Karl-Heinz Wienand