Carl-zeiss-smt Ag

Carl-zeiss-stiftung

Carl Zeiss Smt Gmbh

Carl Zeiss Semiconductor Manufacturing Technologies Ag

Other

Carl Zeiss Sms Ltd.

Tooz Technologies Gmbh

Carl-zeiss-stiftung Trading As Carl Zeiss

Carl-zeiss-shiftung

Karl-Heinz Schuster

Wolfgang Singer

Wilhelm Ulrich

Johannes Wangler

Toralf Gruner

David R Shafer

Alexander Epple

Udo Dinger

Christian Wagner

Martin Antoni

Helmut Beierl

Michael Totzeck

Susanne Beder

Joerg Schultz

Hans-Juergen Mann

Heiko Feldmann

Ulrich Wegmann

Hans-Juergen Rostalski

Ulrich Loering

Martin Schriever

Aurelian Dodoc

Jens Kugler

Norbert Wabra

Daniel Kraehmer

Bernhard Geuppert

Franz Sorg

Wilfried Clauss

Albrecht Ehrmann

Olaf Dittmann

Bernhard Kneer

J&ouml;rg Schultz

Rudolf Von B&uuml;nau

Joachim Wietzorrek

Rainer Hoch

Joerg Mallmann

Gerhard F&uuml;rter

Russell M Hudyma

Hubert Holderer

Rolf Freimann

Stefan Xalter

Alois Herkommer

Wolfgang Hummel

Thomas Scheruebl

Franz-Josef Stickel

Jochen Becker

Jörg Schultz

Joachim Hainz

Wolfgang Harnisch

Birgit Enkisch

Joern Greif-Wuestenbecker

Alexander Sohmer

Norbert Rosenkranz

Christa Müller, Legal Representative

Damian Fiolka

Manfred Maul

Michael Gerhard

Michael Layh

Thomas Korb

Jochen Hetzler

Matthias Manger

Christoph Zaczek

Eric Eva

Ulrich Matejka

Alexandra Pazidis

Winfried M Kaiser

Michael Kuchel

Markus Brotsack

Frank Schillke

Gundula Weiss

Ulrich Stroessner

Harry Bauer

Karl-Stefan Weissenrieder

Hans-Michael Stiepan

Reiner Garreis

Alexander Hirnet

Dieter Schmerek

Klaus Freischlad

Michael Lill

Sebastian Fuchs

Gerd F&uuml;rter

Christian Hettich

Jürgen Hartmaier

Detlev Mueller

Harald Schink

Guenter Scheible, Legal Representative

Frank Marianek

Otto Hahnemann

Gerd Füerter

Rudolph Von Büenau

Gerhard Fürter

Janosch Müller, Legal Representative

Juergen Hartmaier

Gerhart Fuerter

Detlev Müller

An optical element for a display device that can be placed on the head of a user and generate an image as a virtual image. The optical element having a first part, which comprises an optically effective structure, and a second part connected to one another by an adhesive composition comprising a ultra material. The first part material comprises one or more cycloolefin polymers, the first and third material are different from one another, and the second part material and third material in each case comprise at least one organic polymer. The refractive index differences for at least one wavelength between 380 nm and 800 am between the first and the second material and between the second and the third material are in each case &#x2264;0.02. The method of producing the optical element and the display device comprising the optical element are also provided.

Optical element

A microlithographic projection exposure apparatus includes a projection lens that is configured for immersion operation. For this purpose an immersion liquid is introduced into an immersion space that is located between a last lens of the projection lens on the image side and a photosensitive layer to be exposed. To reduce fluctuations of refractive index resulting from temperature gradients occurring within the immersion liquid, the projection exposure apparatus includes heat transfer elements that heat or cool partial volumes of the immersion liquid so as to achieve an at least substantially homogenous or at least substantially rotationally symmetric temperature distribution within the immersion liquid.

Microlithographic projection exposure apparatus and measuring device for a projection lens

A measurement arrangement () and an associated method for interferometrically determining the surface shape () of a test object () includes a light source () providing an input wave () and a diffractive optical element (). The diffractive optical element is configured to produce in each case by way of diffraction from the input wave a test wave (), which is directed at the test object () and has a wavefront that is adapted at least partially to a desired shape of the optical surface, and a reference wave (). The measurement arrangement furthermore includes a reflective optical element () that back-reflects the reference wave () and a capture device () that captures an interferogram produced by superposing the test wave after interaction with the test object and the back-reflected reference wave (), in each case after a further diffraction at the diffractive optical element in a capture plane ().

Interferometric measuring arrangement

Exposure apparatus and measuring device for a projection lens

First test beams (-), after passing through an optical system on optical paths that differ in pairs, impinge on a first measurement region () at angles that differ in pairs with respect to the measurement plane. Second test beams (-), after passing through the optical system on optical paths that differ in pairs, impinge on a second measurement region () at angles that differ in pairs, wherein the second region differs from the first. A value of a first measurement variable of the test beam at the first region is detected for each of the first test beams, and comparably for a second measurement variable at the second region for the second test beams. Impingement regions (-) on reference surface(s) () of the optical system are determined and a spatial diagnosis distribution of a property of the reference surface(s) for each test beam is calculated.

Method for measuring an optical system

An optical imaging system for inspection microscopes with which lithography masks can be checked for defects particularly through emulation of high-aperture scanner systems. The microscope imaging system for emulating high-aperture imaging systems comprises imaging optics, a detector and an evaluating unit, wherein polarizing optical elements are selectively arranged in the illumination beam path for generating different polarization states of the illumination beam and/or in the imaging beam path for selecting different polarization components of the imaging beam, an optical element with a polarization-dependent intensity attenuation function can be introduced into the imaging beam path, images of the mask and/or sample are received by the detector for differently polarized beam components and are conveyed to the evaluating unit for further processing.

Microscope imaging system and method for emulating a high aperture imaging system, particularly for mask inspection

A projection objective of a microlithographic projection exposure apparatus has a high index refractive optical element with an index of refraction greater than 1.6. This element has a volume and a material related optical property which varies over the volume. Variations of this optical property cause an aberration of the objective. In one embodiment at least 4 optical surfaces are provided that are arranged in at least one volume which is optically conjugate with the volume of the refractive optical element. Each optical surface comprises at least one correction means, for example a surface deformation or a birefringent layer with locally varying properties, which at least partially corrects the aberration caused by the variation of the optical property.

Projection objective of a microlithographic projection exposure apparatus

The disclosure relates to an optical system of an illumination device of a microlithographic projection exposure apparatus, including at least one first light-conductance-increasing element having a plurality of diffractively or refractively beam-deflecting structures extending in a common first preferred direction the light-conductance-increasing element having an optically uniaxial crystal material in such a way that the optical crystal axis of the crystal material is substantially parallel or substantially perpendicular to the first preferred direction.

Optical system of an illumination device of a projection exposure apparatus

In certain aspects, the disclosure relates to a projection objective, in particular for a microlithography exposure apparatus, serving to project an image of an object field in an object plane onto an image field in an image plane. The projection objective includes a system aperture stop and refractive and/or reflective optical elements that are arranged relative to an optical system axis. The centroid of the image field is arranged at a lateral distance from the optical system axis). The system aperture stop has an inner aperture stop border which encloses an aperture stop opening and whose shape is defined by a border contour curve. The border contour curve runs at least in part outside of a plane that spreads orthogonally to the optical system axis.

Projection objective and method for optimizing a system aperture stop of a projection objective

Microlithographic projection exposure apparatuses, as well as related components, subsystems and methods are disclosed.

Microlithographic projection exposure apparatus

There is provided a projection objective for a projection exposure apparatus that has a primary light source for emitting electromagnetic radiation having a chief ray with a wavelength&#x2266;193 nm. The projection objective includes an object plane, a first mirror, a second mirror, a third mirror, a fourth mirror; and an image plane. The object plane, the first mirror, the second mirror, the third mirror, the fourth mirror and the image plane are arranged in a centered arrangement around a common optical axis. The first mirror, the second mirror, the third mirror, and the fourth mirror are situated between the object plane and the image plane. The chief ray, when incident on an object situated in the object plane, in a direction from the primary light source, is inclined away from the common optical axis.

Illumination system particularly for microlithography

A projection objective for imaging a pattern provided in an object surface onto an image surface of the projection objective has an object-side imaging subsystem for creating a final intermediate image closest to the image surface from radiation coming from the object surface and an image-side imaging subsystem for directly imaging the final intermediate image onto the image surface. The image-side imaging subsystem includes at least one aspheric primary correcting lens having an aspheric primary correcting surface. The object-side imaging subsystem includes a secondary correcting group having at least one secondary correcting lens having an aspheric secondary correcting surface. Conditions involving maximum incidence angles and subaperture offsets at the correcting surfaces are given which should be observed to obtain sufficient aberration correction at very high image-side numerical apertures NA.

High-NA projection objective with aspheric lens surfaces

A projection objective for imaging a pattern provided in an object plane of the projection objective onto an image plane of the projection objective suitable for microlithography projection exposure machines has a plurality of optical elements transparent for radiation at an operating wavelength of the projection objective. At least one optical element is a high-index optical element made from a high-index material with a refractive index n&#x2267;1.6 at the operating wavelength.

Projection objective having a high aperture and a planar end surface

Growing community of inventors

Koenigsbronn, Germany

Karl-Heinz Schuster