Siemens Aktiengesellschaft

Heraeus Deutschland Gmbh & Co Kg

Messer Group Gmbh

Karl-Heinz Schaller

Wolfgang Schmitt

Rainer Kreutzer

Frank Breer

Heinz Speil

Heinz Wöllmer

Gottfried Hatz

A power semiconductor module is disclosed including a housing for receiving at least one essentially board-type circuit carrier, the circuit carrier being provided with a metallization on at least one part of its surface and being populated with and electrically connected to at least one power semiconductor, rigid, integral and essentially straight load connection elements being applied on the metallized part of the metallized surface of the circuit carrier, which load connection elements are electrically and mechanically fixedly connected to the circuit carrier by one of their ends and project essentially perpendicularly into the housing interior, separate connection terminal elements for electrical conduct-making being placed onto the free end of the load connection elements.

Power semiconductor module comprising load connection elements applied to circuit carriers

Growing community of inventors

Ursensollen, Germany

Karl-Heinz Schaller