Bayer Aktiengesellschaft

Karl-Heinz Kohler

Rudolf Binsack

Leo Morbitzer

Klaus Reinking

Walter Heitz

Ludwig Bottenbruch

Ulrich R Grigo

Klaus Kraft

Josef Merten

Wolfgang Wehnert

Dieter Rempel

Hans-Josef Buysch

Christian Lindner

Karl-Heinz Ott

Kirkor Sirinyan

Erhard Tresper

Norbert Schon

Mark W Witman

Wolfgang Russeler

Ludwig Trabert

Wolfgang Stix

Wolfgang Richter

Rudolph Binsack

Gunter B Weber

This invention relates to crystalline, thermoplastic moulding compounds of polyphenylene sulphide (PPS) and aliphatically saturated carboxylic acid esters. The moulding compounds have increased tracking resistance.

Polyphenylene sulphide moulding compounds with improved electrical

Circuit boards having excellent electrical and mechanical properties are obtained when special mixtures of polyarylene sulfides and polycarbonates, polyaryl ethers, polyamides, polyesters or rubber elastomers are used as base plates for the wet-chemical deposition of the circuits and the boards are treated with an oxidizing agent before activation.

Process for the metallization of moldings of polyarylene sulfides

The invention relates to high molecular weight, substantially linear copolyarylene sulfides predominantly containing biphenylene sulfide units, which are produced by reaction of aromatic halogen compounds and halobiphenylenes with sulfur donors in dipolar aprotic solvents, and to their use for moldings, films and fibers exposed to high temperatures and--preferably in reinforced form--as injection molding compounds.

High molecular weight copolyarylene sulfide

The invention relates to molding compounds of polyarylene sulfides (PAS), preferably polyphenylene sulfides (PPS), which have a low ion content and delayed crystallization and to their use as an encapsulating compound for active and passive electronic components.

Polyarylene sulfide molding compounds and their use as an encapsulating

This invention relates to new high molecular weight, optionally branched co-polyarylene sulphides prepared by the reaction of halogenated aromatic compounds and dihalogenated phenyl-pyrazole-3-ones in a polar solvent with the addition of 0.2 to 100 mol %, based on the dihalogenated aromatic compound, of an amino acid to the reaction mixture, and to the use of these copolyarylene sulphides as embedding compounds for electronic parts.

Pyrazolone substituted copolyarylene sulfide

Polyalkylene terephthalates which contain small quantities of aliphatic polycarbonate show improved fracture behavior, without a significant adverse effect on the strength and the flowability in the melt. Moreover, the compositions show improved behavior in hot-air ageing.

Impact-resistant thermoplastic polyester compositions of low melt

Block copolyesters based on polyalkylene terephthalates which contain polydiene blocks show an extremely low deformation even when they are processed into thin articles. They still have a crystallinity which is decreased by less than the ratio corresponding to the polydiene portion.

Thermoplastic block copolyesters, a process for the preparation thereof

Polyalkylene terephthalates which contain a fluorinated polyolefin in addition to a polymer having a glass transition temperature of less than -30.degree. C., are very tough, exhibit good stability to thermal shaping and hardness, and have a high modulus of elasticity and improved stress/strain behavior.

Thermoplastic moulding compositions based on polyalkylene terephthalate

Thermoplastic moulding compounds obtained from: from 98 to 10 parts, by weight, of aromatic polycarbonates having an average molecular weight M.sub.w (by light scattering) of from 10,000 to 200,000; from 60 to 0 parts, by weight, of polyalkylene terephthalate; from 30 to 0 parts, by weight, of graft polymer of one or more ethylenically unsaturated monomers on a rubber; and from 90 to 2 parts, by weight, of a polyester of terephthalic acid and a diol containing at least one diaryl sulphone group in the molecule and, optionally, an aliphatic diol in addition.

Moulding compositions comprising an aromatic polycarbonate and a sulfone

Block copolyamides consisting of from 1 to 80% by weight of hydrogenated telechelic diene polymers having M.sub.n molecular weight of from 400 to 6000 and from 99 to 20% by weight of polyamides or polyamide-forming components.

Elastomeric block copolyamides

Block copolymers

Block copolyesters based on polyalkylene terephthalates which contain polyene blocks show an extremely low deformation even when they are processed into thin articles. They still have a crystallinity which is decreased by less than the ratio corresponding to the polyene portion.

Growing community of inventors

Krefeld, Germany

Karl-Heinz Kohler