Infineon Technologies Ag

Infineon Technologies Austria Ag

Karl Heinz Gasser

Francisco Javier Santos Rodriguez

Stefan Woehlert

Karl Mayer

Srinivasa Reddy Yeduru

Martin Mischitz

Kae-Horng Wang

John Cooper

A method for processing a wafer in accordance with various embodiments may include: removing wafer material from an inner portion of the wafer to form a structure at an edge region of the wafer to at least partially surround the inner portion of the wafer, and printing material into the inner portion of the wafer using the structure as a printing mask. A method for processing a wafer in accordance with various embodiments may include: providing a carrier and a wafer, the wafer having a first side and a second side opposite the first side, the first side of the wafer being attached to the carrier, the second side having a structure at an edge region of the wafer, the structure at least partially surrounding an inner portion of the wafer; and printing material onto at least a portion of the second side of the wafer.

Method for processing a wafer and wafer structure

Methods, apparatuses and devices relate to inkjet printing a covering layer on at least a first side of a substrate in a peripheral region thereof are discussed.

Inkjet printing in a peripheral region of a substrate

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Spittal Drau, Austria

Karl Heinz Gasser