Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Karl-Friedrich Becker

Tanja Braun

Andreas Ostmann

Michael Töpper

Erik Jung

Lars Böttcher

Ruben Kahle

Harald Von Rosenberg

Mathias Koch

Tanja Dr Braun

Michael Dr Töpper

Jörg Bauer

A method for manufacturing an electronic component can include the following steps: providing a semiconductor arrangement comprising a carrier structure which has at least one semiconductor chip incorporated into a potting compound, and a redistribution layer which comprises a flexible material and at least one strip conductor, wherein the carrier structure at least in regions is connected to the redistribution layer, and the at least one semiconductor chip is electrically conductively connected to the redistribution layer, and separating the carrier structure along at least one trench in a manner such that the carrier structure is divided into at least two singularized carrier elements, wherein two adjacent ones of the singularized carrier elements are connected to one another over the respective trench by way of the redistribution layer.

Method for manufacturing an electronic component and an electronic component

A millimeter-wave radar device including at least one millimeter-wave circuit and at least one antenna, wherein the millimeter-wave radar device is designed as a module having a multilayered multipolymer circuit board having at least a first layer composed of a polymer material having low dispersion of the dielectric constant, a second layer composed of a high-strength polymer material, which stabilizes the multipolymer circuit board, and a metallization layer, which is arranged between the first layer and the second layer and serves for shielding and for signal carrying, and the multipolymer circuit board carries the at least one millimeter-wave circuit and the at least one antenna.

Millimeter-wave radar

A method for producing encapsulated chips includes preparing a wafer with contacts projecting from a surface of the wafer. The wafer is disposed on a dicing substrate and diced into a plurality of spaced chips on the dicing substrate. The contacts are covered with a protection arrangement, then injection molding being conducted to introduce encapsulation material into the contacts and the trenches. Then the protection arrangement is removed so that the contacts are exposed.

Method for producing encapsulated chips

Growing community of inventors

Berlin, Germany

Karl-Friedrich Becker