Applied Materials, Inc.

Cavendish Kinetics Limited

Qorvo US, Inc.

Karl F Smayling

Michael C Smayling

James D Huffman

Robertus Petrus Van Kampen

Cong Quoc Khieu

Vikram Joshi

Shiany Oemardani

James Douglas Huffman

The present invention generally relates to a mechanism for testing a MEMS hysteresis. A power management circuit may be coupled to the electrodes that cause the movable plate that is disposed between the electrodes in a MEMS device to move. The power management circuit may utilize a charge pump, a comparator and a resistor ladder.

Internally generated DFT stepped hysteresis sweep for electrostatic MEMS

In some aspects, a method is provided for detecting a void in a test structure that comprises (a) measuring a resistance of the test structure; (b) applying a stress to the test structure at increasing levels until at least one of: (i) the measured resistance of the test structure exceeds a predetermined resistance threshold; and (ii) the stress level reaches a predetermined stress maximum; (c) detecting a void if the measured resistance of the test structure exceeds the predetermined resistance threshold; and (d) determining that the test structure is void free if the stress level reaches the predetermined stress maximum without the measured resistance of the test structure exceeding the predetermined resistance threshold. Numerous other aspects are provided.

Methods and apparatus for detecting defects in interconnect structures

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San Jose, CA, United States of America

Karl F Smayling