Chemcut Corporation

Karl F Ketelhohn

Donald F Ball

James J Ash

Randall E Markle

An apparatus is provided for controlled spray etching, in which panels, such as printed circuit boards are delivered through an etching chamber, to have a spray etchant sprayed generally on upper and lower surfaces of the panel. The spray is controlled such that a reduced amount of etchant is provided on the perimeter surface portions of the panel, relative to the central surface portions of the panel, transversely of the path of travel of the panels through the etching chamber. The spray may be varied in amount, preferably by varying the pressure at different locations transversely of the chamber; the spray longitudinally through the chamber, may vary, to spray leading and trailing surface portions of the panels a lesser amount than central portions of the panels, measured longitudinally. The control of the spray of leading and trailing surface portions of the panels may be facilitated by one or more sensors that control an intermittent discharge of spray etchant near the inlet to the etch chamber.

Apparatus for controlled spray etching

A method and apparatus is provided for controlled spray etching, in which panels, such as printed circuit boards are delivered through an etching chamber, to have a spray etchant sprayed generally on upper and lower surfaces of the panel. The spray is controlled such that a reduced amount of etchant is provided on the perimeter surface portions of the panel, relative to the central surface portions of the panel, transversely of the path of travel of the panels through the etching chamber. The spray may be varied in amount, preferably by varying the pressure at different locations transversely of the chamber; the spray longitudinally through the chamber, may vary, to spray leading and trailing surface portions of the panels a lesser amount than central portions of the panels, measured longitudinally. The control of the spray of leading and trailing surface portions of the panels may be facilitated by one or more sensors that control an intermittent discharge of spray etchant near the inlet to the etch chamber.

Method and apparatus for controlled spray etching

An apparatus and method is disclosed for transporting thin materials, such as printed circuit boards or films, in an etching or other chemical treatment operation whereby a series of guide members, such as wires, which move back and forth in a reciprocating manner, guide the articles being transported through the apparatus and facilitate generally uniform treatment coverage of the articles with a treatment fluid.

Apparatus and method for transporting materials which are to be

A method and apparatus is provided for fluid treatment of articles, while the articles are being delivered along a path through a preferably substantially closed chamber. During treatment, the articles are conveyed by rotating disk-like members that establish their path, with the disks being mounted on shaft-like rods for movement therewith. The treatment can comprise spraying or flooding the articles with a liquid or a gas, or may comprise drawing of air or other gases from the vicinity of the articles, or even drawing of liquid from the vicinity of the articles, if desired. Whatever the fluid treatment, it is provided by means of individual nozzles that are mounted between disk-like members on the rods, and which are there adapted for movement with the rods. In one embodiment, the nozzles may be mounted opposed each other, with openings for fluid generally opposed each other, above and below a generally horizontal path of travel such that articles pass between the nozzles. In instances in which the articles being treated are printed circuit boards, fluid may either be drawn through through-holes in printed circuit boards, or fluid may be applied to the boards, depending upon the direction of fluid flow.

Process and apparatus for fliud treatment of articles

A process and apparatus for fluid treating articles delivered along a predetermined path through a zone where the angle of application of such fluid is varied. A plurality of discharge orifices at different pre-set angular orientations are provided at such zone to sequentially discharge and interrupt treating fluid in a controlled manner to impinge upon the articles at different angles of impingement. The orifices are provided in sets at said orientations and are alternatively open and closed to delivery the fluid sequentially by means of appropriate valving with sufficient force to prevent puddling as the articles are conveyed along a generally horizontal path.

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State College, PA, United States of America

Karl F Ketelhohn