Curamik Electronics Gmbh

Siemens Aktiengesellschaft

Curamic Electronics Gmbh

Karl Exel

Jürgen Schulz-Harder

Karsten Schmidt

Andreas Meyer

Alexander Rogg

Bernd Medick

Veronika Bauer-Schulz-Harder

Kai Kriegel

Guy Lefranc

Lothar Kugler

Andreas Karl Frischmann

A method is disclosed for producing metal-ceramic substrates that are metallized on both sides by using the direct bonding process. According to the method, at least one DCB stack made from first and a second metal layer and a ceramic layer located between said metal layers is formed on a separating layer of a support by heating to a direct bonding temperature. At least one of the metal layers rests against the separating layer during the bonding process, said separating layer being composed of a porous layer or coating made of a separating layer material from the group comprising mullite, AlO, TiO, ZrO, MgO, CaO CaCOor a mixture of at least two of said materials.

Method for the production of a metal-ceramic substrate or copper-ceramic substrate, and support to be used in said method

Disclosed is a metal-ceramic substrate made up of at least one ceramic layer which is provided with metallizations on both faces. In order to obtain a partial discharge resistance of less than 10 pC at a predefined measuring voltage, the thickness of the ceramic layer amounts to about one sixth of the measuring voltage.

Metal-ceramic substrate

At least one power semiconductor component is cooled by a flat, copper, plate-type hollow body conducting a coolant fluid. Components are fixed on one flat-sided surface of the hollow body and the other flat-sided surface includes two coolant fluid openings for introducing the coolant fluid into the hollow body and for evacuating the fluid therefrom. The other flat-sided surface is concave and elastically deformable between the coolant fluid openings. The concave other surface is attached to the even surface of a support in such a way that the concave surface and the even surface are pressed against each other by the elastically planar deformation of the concave surface and that the coolant fluid openings are sealed in a fluidproof manner by O-rings. A solid strut, which interconnects the two flat-sided surfaces is additionally configured in the hollow body. The cooling device may be used in a module or an assembly including a support and the cooling device or module. The device is useful in electric transmissions, in particular, in motor vehicles.

Cooling devices for cooling electric components, module including cooling device and electric components, and assembly of cooling device or module and support

A mirror for laser application and a method for manufacturing the mirror is disclosed herein. The mirror comprises several layers including a top layer used as the mirror surface. A cooling structure including a plurality of cooler layers are providing between the top layer, several intermediate layers and a bottom layer. Connections are provided for allowing a coolant to flow within the mirror. The mirror is constructed by stacking the layers on top of one another and connecting adjacent layers together by direct copper bonding or active soldering.

Mirror for laser applications and method for manufacture of said mirror

A process for manufacturing a metal ceramic substratum for use as a substrate in electrical or electronic circuits or components which includes utilizing an unique form mold process. At least one blank ceramic plate is shaped in a form mold through a desired set of process steps. The steps include heating and cooling to desired temperatures at desired heat and cool rates.

Process for the manufacturing of an arched metal ceramic substratum

The invention relates to a novel process for producing a copper ceramic substrate with at least one through-plated hole, with a ceramic layer which has at least one opening for the through-plating, on one surface side is provided with a first metal coating and on the opposite surface side with a second metal coating which extends into at least one opening and is connected to the first metal coating, for formation of the first metal coating a copper foil being applied by DCB technique to one surface side of the ceramic layer.

Process for producing a ceramic-metal substrate

The invention relates to a novel ceramic substrate with at least one layer essentially of aluminum nitride which is provided on at least one surface side with an intermediate or auxiliary layer which contains aluminum oxide and which has a thickness in the range of 0.5-10 microns, and to a process for its production.

Process for producing a ceramic substrate and a ceramic substrate

The invention relates to a cooler for use as a heat sink for electrical components or circuits consisting of several cooler layers which are joined flat to one another, which are stacked on top of one another, which form between channels through which coolant flows and which each discharge into at least one first collection space for supply of the coolant and into a second collection space for draining the coolant, the collection spaces being formed by openings in the cooler layers and the cooling channels by structuring at least one area of the coolant layers with openings, the area being between the openings.

Cooler or heat sink for electrical components or circuits and an

A microcooler with channels through which coolant flows. The channels are formed by individual cooler layers having a region which is structured in the manner of a screen and having a plurality of openings with edge lines closed and with material bridges or material regions remaining between these openings. None of the openings on any of the cooler layers form a continuous channel which extends from a collection space for feed of the coolant to a collection space for drainage of the coolant. The individual breaches, and the material bridges or material regions, provided between them are offset from cooler layer to cooler layer such that flow of the coolant through the cooler is possible only with continuous changing of the layers. Using the breaches within the cooler results in a highly branched labyrinth through which coolant flows. The size of the breaches and the width of the material sections and material bridges are matched to one another such that flow through is possible with continuous changing of the layers. This microcooler has the advantage that very intensive flow around the bridges and material regions formed by the individual layers takes place by the heat-transporting medium so that intensive heat transfer is achieved between this medium and the layers of the microcooler.

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Rimbach, Germany

Karl Exel