Telefonaktiebolaget Lm Ericsson (publ)

Karl-Erik Leeb

Ulf I Holmberg

Lars T Persson

For sealing and shielding purposes, a laminate is used, including a layer of ionomer plastics bonded to a metal sheet or a metal plate. The bonding is made without any addition of adhesive agents between the plastics layer and the metal surface by pressing, in a heated state, the plastics layer against a well cleaned surface. The metal should be such a kind, that its surface is oxidized when stored in air. A multi-layer laminate is used, where one metal layer provides a good electrical shielding and an outermost metal layer provides good mechanical strength. The plastics layer at the inner side of a laminate is in the same way bonded directly to margins of electrical connector terminals made of metal.

Laminate for sealing capsules

An arrangement for sealed contact devices and a method of producing the arrangement by laminating a centring device (6) to a barrier layer (4) and conductor pins (1) centred and guided therein with an adhesive plastic material (8), and by forming a combined lid and contact device which is electrically screening and impervious to moisture.

Electric contact sealing arrangement

The present invention relates to a method and device for functional protection of connectors where a heat-emitting means heats contact pins while certain selected parts of the pins are preferably covered with heat-insulating material (12) which furthermore can be contamination- and gas-tight. In this way contamination of the contact pins and condensation of moisture is counteracted which leads to a longer life because of less corrosion and leakage currents being prevented. These problems are specially common in connectors for electronic constructions which are cooled with exterior air and/or are used outdoors.

Method and device for preventing corrosion of electrical connectors

The present invention relates to a method and a device for protecting electronics which are cooled with exterior air. The device comprises an electronic circuit (8) arranged on an electronic support (1) with associated connector (7), which electronic circuit (8) consists of electronic components and/or subcircuits. The device is characterized in that it comprises on the one hand a first casing (2) which surrounds the electronic circuit (8) and towards and over the surface of which a cooling air current (30) is led, on the other hand a second casing (6) which is arranged to cooperate with the first casing (2) so that a connector (7) associated with the electronic circuit (8) is protected from the cooling air current (30) in a space (13, 16) separated from the cooling air current (30). An object with the present invention is to protect electronic equipment with associated connectors from moisture, gas and contaminants in exterior air and thereby obstruct corrosion damage and leakage currents which occur when exterior air is used for cooling.

Device and method for cooling and protecting electronics

Device for pressing plastics

Method of injection-moulding plastics for electrical shielding casings

Flexible device for encapsulating electronic components

An arrangement for establishing electrical contact in joints, and a method of producing the arrangement. The arrangement comprises an electric contact making device which is enclosed in a joint between two metal surfaces between which electrical contact shall be established. The joint and the contact making device are held together and protected by plastic material. The arrangement is produced by applying pressure to the joint so that the surface penetrating devices of the contact making device will spring, and by converting the plastic material from a fluid state to a solid state while maintaining the pressure, so that the resilient biassing effect of the surface penetrating devices against the metal surfaces will be made permanent in the arrangement.

Method of producing an arrangement for establishing contact in joints

An arrangement for cooling electronic equipment in a space by using radiation transfer, wherein the equipment includes heat-emitting electronic components mounted on a circuit board or the like. According to the invention, each circuit board or the like is surrounded by a cold plate which is spaced from the circuit board. The surfaces of both the circuit board and the plate are treated so as to have a high IR-radiation coefficient, wherein heat is transferred from the hot circuit board to the relatively colder plate by radiation.

Arrangement for cooling electronic equipment by radiation transfer

Arrangement for establishing electrical contact in joints, and a method

In a method of manufacturing a circuit board having a lateral conductive pattern and shield regions, a first laminate of a substrate, covered on one side by a copper foil, is contour cut whereafter a second entirely covering copper foil is laminated to the second side of the substrate, and a conductive pattern of signal conductors and ground conductors is etched in the second copper foil. The second substrate is also contour cut and is laminated to a copper foil, whereafter a window is etched in the copper foil, corresponding to a window cut in the substrate. The second laminate thus formed is adjusted in regard of the pattern to the first laminate and is adhesively secured thereto, the side of the second laminate covered by the copper foil turned away from the wide of the first laminate provided with the conductive pattern. A metal layer is thereafter applied to the surface of the first laminate facing away from the side having the conductive pattern and the lateral edges to electrically connect the surface, the ground conductors of the conductive pattern and the foil on the second substrate, whereafter components are mounted in the windows in the second laminate to the conductive pattern.

Method of manufacturing circuit board having lateral conductive pattern

A device with laminated conductive patterns and dielectrics which can be selected without consideration of its bonding characteristics in regard of copper metal comprises a conductor means comprising a support frame with a window in which one or more etched conductors are arranged. The conductor means is located on one surface of a dielectric sheet or between two such sheets.

Device comprising laminated conductive patterns and easily selectable

In a device having flexible, stripline conductors surrounded by a dielectric and ground planes, a conductor laminate (1) comprising a substrate (1) and conductors etched on one of its surfaces and windows cut between the conductors and a ground plane laminate comprising a substrate cut essentially similarly to the substrate of the conductor laminate with somewhat larger dimensions and a copper foil arranged on one of the sides of the substrate are adhesively bonded to each other with the conductors of the conductor laminate engaged with that side of the substrate of the ground plane laminate which is not covered by a foil. A metallization is provided on the side of the device which is opposite to the foil covered surface of the ground plane laminate. This metallization is electrically connected to said foil covered surface such that conductors and substrates are completely enclosed by an electrically conducting layer.

Device with flexible, stripline conductors and a method of manufacturing

A circuit board with a lateral conductive pattern and shielded regions comprises a first contour cut laminate of a substrate having a conductive pattern of signal conductors and ground conductors on one side and a copper foil on the other side, covering the entire side. This laminate is laminated with the side provided with the conductive pattern to a second laminate also comprising a contour cut substrate and a copper foil provided on the substrate on the side opposite to the first laminate. Windows are cut in the substrate of the second laminate and are etched away in the top copper foil to enable mounting of components to the conductive pattern in the windows. A metal layer is provided to electrically connect said foil covering the entire other side of the first laminate with the ground conductors of the conductive pattern and the foil of the second laminate. In a method of manufacturing such a circuit board a first laminate of a substrate, covered on one side by a copper foil, is contour cut whereafter a second entirely covering copper foil is laminated to the second side of the substrate, and a conductive pattern of signal conductors and ground conductors is etched in the second copper foil. The second substrate is also contour cut and is laminated to a copper foil, whereafter a window is etched in the copper foil, corresponding to the window cut in the substrate. The second laminate thus formed is adjusted in regard of the pattern to the first laminate and is adhesively secured thereto, the side of the second laminate covered by the copper foil turned away from the side of the first laminate provided with the conductive pattern. A metal layer is thereafter applied to the surface of the first laminate facing away from the side having the conductive pattern and the lateral edges to electrically connect said surface, the ground conductors of the conductive pattern and the foil on the second substrate, whereafter components are mounted in the windows in the second laminate to the conductive pattern.

Circuit board having a lateral conductive pattern and shielded regions

The present invention relates to a method of manufacturing a heat transfer device, particularly a heat transfer device for cooling electronic components, having a metal plate and a plurality of cylindrical metal pins which are packed relatively densely on the plate and extend perpendicularly therefrom. The inventive method comprises the steps of cleaning the plate (1) and the pins (2) and treating the same with fluxing agent; loading the pins (2) into a pin holding device (4, 7) and affixing the pins by means of said device in mutually radial positions and holding the pins at an axial distance above the plate (1). Solder material (13) is applied to the plate (1) and caused to melt. The pins (2) are then lowered simultaneously down into the molten solder (13) and the solder is caused to solidify while maintaining the pins (2) in their fixed radial positions, whereafter the holder device (4, 7) is removed. The invention also relates to a tool in the form of a holding device intended for use in the manufacture of a heat transfer device and for carrying out the method.

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Djurhamn, Sweden

Karl-Erik Leeb