Broadcom Corporation

Toyota Motor Engineering & Manufacturing North America, Inc.

University of Ottawa

Karin Hinzer

Ercan Mehment Dede

Simon Fafard

Denis Paul Masson

Matthew Wilkins

Philippe-Olivier Provost

Christopher Valdivia

An optical power transfer device with an embedded active cooling chip is disclosed. The device includes a cooling chip made of a semiconductor material, and a first subassembly and a second subassembly mounted on the cooling chip. The cooling chip comprises at least one metallization layer on a portion of a first surface of the cooling chip, at least one inlet through a second surface of the cooling chip, wherein the second surface is opposite to the first surface, at least one outlet through the second surface and one or more micro-channels extending between and fluidly coupled to the at least one inlet and the at least one outlet. A cooling fluid flows through the one or more micro-channels. The first subassembly is mounted on the at least one metallization layer and comprises a laser. The second subassembly comprises a phototransducer configured to receive a laser beam from the laser.

Optical power transfer devices with an embedded active cooling chip

Growing community of inventors

Ottawa, Canada

Karin Hinzer