Intel Corporation

Kari Mansukoski

Juha Paavola

Mark Charles Carbone

Samarth Alva

Justin Michael Huttula

Todd L Smith

Bala P Subramanya

Satyajit Siddharay Kamat

Sami Markus Heinisuo

Nagaraj K

A circuit board and vapor chamber are disclosed. Connectors couple the vapor chamber to a circuit board. The connectors extend from the bottom of the vapor chamber. The connectors fix the vapor chamber to the circuit board such that the bottom of the vapor chamber thermally couples to a heat source on the circuit board. The circuit board has a connector assembly that couples to the vapor chamber.

Thermal solution as an effective EMI shield

thermal management systems having signal transfer routing for use with electronic devices are disclosed. An electronic device includes a housing to house a first electronic component and a second electronic component. A circuit board is positioned inside the housing. The circuit board including a first signal path to communicatively couple a processor carried by the circuit board and the first electronic component. A thermally conductive structure is positioned adjacent the circuit board. The thermally conductive structure is to dissipate heat generated by the processor. The thermally conductive structure is to carry at least a portion of a second signal path to communicatively couple the processor and the second electronic component.

Thermal management systems having signal transfer routing for use with electronic devices

Growing community of inventors

Hillsboro, OR, United States of America

Kari Mansukoski