Henkel Corporation

Rohm & Haas Electronic Materials LLC

Dow Global Technolgoies LLC

Karen R Brantl

Michael K Gallagher

Mark S Oliver

Andrew D Messana

Philip T Klemarczyk

Christopher John Tucker

Elissei Iagodkine

Zhifeng Bai

Zidong Wang

Shabbir Attarwala

Ling Li

Philp T Klemarczyk

Gregory T Schueneman

Philp T Kelmarczyk

Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.

Ephemeral bonding

Compositions containing an adhesive material and a release additive are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a component, such as an active wafer, is temporarily bonded to a substrate, followed by further processing of the active wafer.

The present disclosure provides a cyanoacrylate-based composition comprising a cyanoacrylate component and an organic micropulp component dispersed in a curable (meth)acrylic monomer matrix. The composition is particularly useful as an adhesive composition for zero gap applications.

Cyanoacrylate compositions incorporating organic micropulp

The present invention relates to new cure accelerators for anaerobic curable compositions. These anaerobic cure accelerators are generally sulfonimide derivatives and sulfonamide derivatives.

Cure accelerators for anaerobic curable compositions

The present invention relates to phenylgycines and derivatives thereof, 1,4-aminobenzoyl compounds, and phenyl pyrazolinones as cure accelerators for anaerobically curable compositions.

The present invention relates to new cure accelerators for anaerobic curable compositions. These anaerobic cure accelerators are generally sulfinimides and oxygen and sulfur derivatives thereof, sulfonimides and oxygen and sulfur derivatives thereof, sulfonamides and oxygen and sulfur derivatives thereof, and oxygen and sulfur analogues of sulfimides.

The present invention relates to phenyl glycines and derivatives thereof as cure accelerators for anaerobic curable compositions.

This invention relates to latent foamable compositions for use in or as adhesives, sealants and/or coatings. The compositions include a curable component or a thermoplastic component, together with a latent foaming agent. In curable versions of the inventive compositions, a cure initiator or catalyst may also be included.

Foamable compositions

The present invention provides a new class of materials effective as cure accelerators for anaerobic curable compositions. The addition of these materials into anaerobic adhesives as a replacement for conventional curatives, such as acetyl phenyl hydrazine and maleic acid or toluidines, surprisingly provides at least comparable cure speeds and physcial properties for the reaction products formed therefrom.

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West Springfield, MA, United States of America

Karen R Brantl