Electronic Polymers, Inc.

Electromer Corporation

Other

Eos Technologies, Inc.

Karen P Shrier

Richard K Childers

John H Bunch

Hugh M Hyatt

In one embodiment, there is provided a printed circuit board including a first rigid circuit board layer having a first signal trace arrayed on it, a second rigid circuit board layer having a second signal trace arrayed on it, a first signal path coupled between the first signal trace and the second signal trace, an electrostatic discharge device located between the first rigid circuit board layer and the second rigid circuit board layer, the electrostatic discharge device having a first electrode coupled to the first signal path, an electrostatic discharge reactance layer coupled to the first electrode, and a second electrode coupled to the electrostatic discharge layer but not coupled to the first signal path. The circuit board also having a ground plane, where the ground plane is coupled to the second electrode.

Devices and system for electrostatic discharge suppression

A electrostatic discharge suppression device including an electrostatic discharge reactance layer having a first side and a second side, a first electrode coupled to the first side and comprising a first extension projecting towards a first distal end of the device, and a second electrode coupled to the second side and including a second extension projecting towards a second end of the device, such that the first extension and the second extension overlap to form an electrode overlap area, wherein during an electrostatic discharge event, an electric current is passed between the first and second extensions through the electrostatic discharge layer in the electrode overlap area.

Devices capable of protecting electronic components during the occurrence of a disturbance event using printed circuit board manufacturing techniques. A three (3) layer structure is formed comprising a polymer-based formulation sandwiched between two electrode layers. The devices can be manufactured in panel form providing high quantities of devices which can be removed from the panel and applied directly to the component to be protected. Desired patterns can be formed on either one of the electrode layers by photo-etch techniques thereby providing a process that can be tailored to a large number of applications.

ESD protection devices and methods of making same using standard manufacturing processes

A device () for suppressing electrostatic discharge comprises first and second multilayer structures () surrounding an electrostatic discharge reactance layer (), the resistance of said electrostatic discharge reactance layer () varying in response to the occurrence of an electrostatic discharge signal. Each multilayer structure () comprises a barrier layer (), a terminal layer () and an electrode layer (). Alternatively, a conductive layer () can be used instead of a second multilayer structure (). An ESD suppression device () can be embedded in a printed circuit board () providing a way to protect board components from harmful ESD events.

Devices and systems for electrostatic discharge suppression

Method of manufacturing devices to protect election components

A nonlinear transient overvoltage protection coating material and process for coating are disclosed herein. The viscous paintable material is for overvoltage protection and/or for use in detecting pressure externally applied to the material. A binder substance is combined with conductive particles and a solvent.

Paintable/coatable overvoltage protection material and devices made

A connector is disclosed which includes a plurality of leads and a conductive plate. The plate includes a number of bores extending through it. The leads are spaced apart the walls of the bores. A quantum mechanical tunneling material is placed between the leads and the walls of the bores in order to support the leads. This configuration serves to connect the leads to the plate by quantum mechanical tunneling when the voltage between the leads and the plate exceeds a predetermined voltage.

Electrical connector with overvoltage protection feature

A material and device for electronic circuitry that provides protection from fast transient over-voltage pulses. The electroded device can additionally be tailored to provide electrostatic bleed. Conductive particles are uniformly dispersed in an insulating matrix or binder to provide material having non-linear resistance characteristics. The non-linear resistance characteristics of the material are determined by the inter-particle spacing within the binder as well as by the electrical properties of the insulating binder. By tailoring the separation between the conductive particles, thereby controlling quantum-mechanical tunneling, the electrical properties of the non-linear material can be varied over a wide range.

Overvoltage protection device and material

A material device for electronic circuitry that provides pro-tection from fast transient overvoltage pulses. The electroded device can additionally be tailored to provide electrostatic bleed. Conductive particles are uniformly dispersed in an insulating matrix or binder to provide material having non-linear resistance characteristics. The non-linear resistance characteristics of the material are determined by the interparticle spacing within the binder as well as by the electrical properties of the insulating binder. By tailoring the separation between conductive particles, thereby controlling quantum-mechanical tunneling, the electrical properties of the non-linear material can be varied over a wide range.

A material provides protection against electrical overstress transients having rise times as rapid as a few nanoseconds or less. The material comprises a matrix formed of a mixture of separate particles of conductive materials and separate particles of semiconductor materials coated with insulating material to provide chains of the particles within the matrix with interparticle separation distances along the chains less than several hundred angstroms, thereby to permit quantum-mechanical tunneling of electrons between the separate particles in response to high energy electrical transients.

Growing community of inventors

Half Moon Bay, CA, United States of America

Karen P Shrier