Growing community of inventors

Richardson, TX, United States of America

Karen Kirmse

Average Co-Inventor Count = 6.00

ph-index = 2

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 18

Karen KirmseBenjamin Stassen Cook (4 patents)Karen KirmseKurt Peter Wachtler (4 patents)Karen KirmseBrian Goodlin (4 patents)Karen KirmseStuart M Jacobsen (4 patents)Karen KirmseGenki Yano (4 patents)Karen KirmseMakoto Yoshino (4 patents)Karen KirmseAyumu Kuroda (4 patents)Karen KirmseAntonio L P Rotondaro (1 patent)Karen KirmseYuanning Chen (1 patent)Karen KirmseBrian E Goodlin (0 patent)Karen KirmseKaren Kirmse (5 patents)Benjamin Stassen CookBenjamin Stassen Cook (170 patents)Kurt Peter WachtlerKurt Peter Wachtler (38 patents)Brian GoodlinBrian Goodlin (35 patents)Stuart M JacobsenStuart M Jacobsen (32 patents)Genki YanoGenki Yano (14 patents)Makoto YoshinoMakoto Yoshino (14 patents)Ayumu KurodaAyumu Kuroda (5 patents)Antonio L P RotondaroAntonio L P Rotondaro (40 patents)Yuanning ChenYuanning Chen (17 patents)Brian E GoodlinBrian E Goodlin (0 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Texas Instruments Corporation (5 from 29,279 patents)


5 patents:

1. 11498831 - Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip

2. 10723616 - Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip

3. 10233074 - Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip

4. 9896330 - Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip

5. 7033897 - Encapsulated spacer with low dielectric constant material to reduce the parasitic capacitance between gate and drain in CMOS technology

Please report any incorrect information to support@idiyas.com
idiyas.com
as of
1/5/2026
Loading…