Average Co-Inventor Count = 3.19
ph-index = 10
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Massachusetts Institute of Technology (46 from 8,369 patents)
2. Gvd Corporation (5 from 15 patents)
3. Other (2 from 832,680 patents)
4. The Charles Stark Draper Laboratory, Inc. (2 from 1,067 patents)
5. Analog Devices,inc. (1 from 3,621 patents)
6. King Fahd University of Petroleum and Minerals (1 from 3,201 patents)
7. Cornell Research Foundation Inc. (1 from 1,521 patents)
8. University of Chicago (1 from 915 patents)
9. Eni S.p.a. (1 from 370 patents)
10. Luxembourg Institute of Science and Technology (1 from 62 patents)
11. Semiconductor Research Corporation (1 from 4 patents)
53 patents:
1. 11987657 - Durable water resistant coatings
2. 11837403 - Supercapacitors and other electrodes and methods for making and using same
3. 11677078 - Ultrathin conformal oCVD PEDOT coatings on porous electrodes and applications thereof
4. 11017958 - Monolithic flexible supercapacitors, methods of making and uses thereof
5. 10898861 - Ultrathin, conductive and fouling-resistant zwitterionic polymer films
6. 10867719 - Enhancing performance stability of electroactive polymers by vapor-deposited organic networks
7. 10755942 - Method of forming topcoat for patterning
8. 10583677 - Nanoporous stamp printing of nanoparticulate inks
9. 10543516 - Liquid-impregnated coatings and devices containing the same
10. 10519326 - Antifouling and chlorine-resistant ultrathin coatings on reverse osmosis membranes
11. 10510971 - Vapor-deposited nanoscale ionic liquid gels as gate insulators for low-voltage high-speed thin film transistors
12. 10155843 - Ultra-thin, pinhole-free, flexible metal-organic films
13. 10118426 - Nanoporous stamp for flexographic printing
14. 9957618 - Single-unit reactor design for combined oxidative, initiated, and plasma-enhanced chemical vapor deposition
15. 9884341 - Methods of coating surfaces using initiated plasma-enhanced chemical vapor deposition