Laird Technologies Gmbh

Other

Karen Bruzda

Jason L Strader

Kathryn Cancar

Mark Wisniewski

Michael D Craig

Richard F Hill

Troy Dewayne Derksen

John David Ryan

David B Wood

Disclosed are exemplary embodiments of thermally-conductive electromagnetic interference (EMI) absorbers. In exemplary embodiments, the thermally-conductive EMI absorber may have a thermal conductivity of at least 6 Watts per meter per Kelvin (W/mK) and an attenuation greater than 15 decibels per centimeter (dB/cm) at a frequency of 10 gigahertz (GHz) or higher.

Thermally-conductive electromagnetic interference (EMI) absorbers

Disclosed are exemplary embodiments of thermal interface materials with low secant modulus of elasticity and high thermal conductivity.

Thermal interface materials with low secant modulus of elasticity and high thermal conductivity

Disclosed are exemplary embodiments of thermal management and/or EMI (electromagnetic interference) mitigation materials with modified or custom colored exterior surfaces. The thermal management and/or EMI mitigation materials disclosed herein may comprise thermal interface materials (e.g., thermally-conductive pads or gap fillers, thermally-conductive dielectric materials, etc.), EMI shielding materials (e.g., EMI suppression materials, electrically-conductive thermal insulators, EMI absorbers etc.), microwave absorbers (e.g., microwave absorbing elastomers, microwave absorbing foams, EMI/RF/microwave absorbers, etc.), combinations thereof, etc. The thermal management and/or EMI mitigation materials disclosed herein may comprise combined thermal management and EMI mitigation materials, such as hybrid thermal/EMI absorbers, thermally-conductive microwave absorbers, hybrid absorber/thermal management materials usable for EMI mitigation, combined thermal interface and EMI shielding materials (e.g., thermally-conductive and electrically-conductive materials, thermally-conductive and EMI shielding/absorbing materials, etc.), etc.

Thermal management and/or EMI mitigation materials with custom colored exterior surfaces

Materials are disclosed that include or are based on thermally reversible gels, such as thermally reversible gelled fluids, oil gels and solvent gel resins. In an exemplary embodiment, a material includes at least one filler in a thermally reversible gel.

Materials including thermally reversible gels

According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0001 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.

Thermal interface materials with thin film or metallization

Thermal interface materials are disclosed that include or are based on thermally reversible gels, such as thermally reversible gelled fluids, oil gels and solvent gel resins. In an exemplary embodiment, a thermal interface material includes at least one thermally conductive filler in a thermally reversible gel.

Thermal interface materials including thermally reversible gels

A thermal interface material is configured for use with an electronic device for transferring heat between heat generating components and heat removing components of the electronic device. The thermal interface material generally includes a first material (e.g., a gap filler, etc.) incorporating a contact resistance reducing material. The contact resistance reducing material operates to fill interstitial voids of surfaces of components in which the first material is installed to thereby reduce surface contact resistance between the first material and the component surfaces. The contact resistance reducing material may be applied to one or more side surfaces of the first material. Or, alternatively, the contact resistance reducing material may be blended in the first material.

Thermal interface materials

According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0005 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.

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Cleveland, OH, United States of America

Karen Bruzda