International Business Machines Corporation

Karen Ann Bard

Herbert Lei Ho

David M Dobuzinsky

Ronald Dennis Rose

Michael D Steigerwalt

S Sundar Kumar Iyer

Michael H Sitko

Denise Pendleton

Brian L Walsh

Mahendar Kumar

A method, system and program product for designing an integrated circuit (IC) for signal integrity. The invention conducts a signal integrity analysis on an IC design; identifies any field effect transistor (FET) that causes a signal integrity failure in the case that the IC design fails the signal integrity analysis; and modifies an edge of a failing FET that is closer than a threshold distance to a well edge. The invention eliminates the manual, iterative procedure for determining the device causing a signal integrity failure due to well proximity effects.

Integrated circuit design for signal integrity, avoiding well proximity effects

A method for determining contact location for embedded dynamic random access memory (eDRAM) formed in a silicon-on-insulator (SOI) substrate includes reviewing contact design data for an eDRAM device and discarding contact locations corresponding to contact shapes within a support area of the eDRAM device. Contact locations corresponding to bitline contacts to storage cells within the eDRAM device are saved and outputted to a custom design level to be used in forming body contacts for the eDRAM formed in the SOI substrate.

Method for determining cell body and biasing plate contact locations for embedded dram in SOI

A test arrangement includes a semiconductor device, a first conductive pad electrically connected to the semiconductor device, a second conductive pad, and a programmable fuse. The second conductive pad is electrically connected to the semiconductor device through the programmable fuse.

Semiconductor device test arrangement with reassignable probe pads

A DRAM array in an SOI wafer having a uniform BOX layer extending throughout the array eliminates the collar oxide step in processing; connects the buried plates with an implant that, in turn, is connected to a conductive plug extending through the device layer and the box that is biased at ground; while the pass transistors are planar NFETs having floating bodies that have a leakage discharge path to ground through a grounded bitline.

SOI trench capacitor cell incorporating a low-leakage floating body array transistor

A method for generating a patterned SOI photomask used for embedded DRAMs is described. The method systematically identifies embedded DRAM areas to be excluded from the SOI process and generates the shapes to be printed on the photomask so that the embedded DRAM may be fabricated on bulk silicon. The method includes the steps of: identifying and sorting DRAM array well shapes by common electrical net, resulting in a single array well shape for each electrical net (i.e., embedded DRAM cell). Next, all the n-band contacts touching a given array well shape are collected. These shapes are merged by common electrical net. A shape is then generated which is the smallest enclosing rectangle of the common electrical net of the n-band contact shapes. This represents the patterned SOI shape and defines the bulk areas onto which the embedded DRAM is to be built. Accordingly, the embedded DRAM macro is constructed in bulk areas while the logic is constructed in SOI.

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Hopewell Junction, NY, United States of America

Karen Ann Bard