Kla Tencor Corporation

Icos Vision Systems Nv

Karel Van Gils

Guoheng Zhao

Johan De Greeve

Andy Hill

Maarten Van Der Burgt

Sheng Liu

Carl Smets

Andrew V Hill

Stanley E Stokowski

Benoit Maison

Carl Truyens

Christophe Wouters

Erik De Block

Bruno Accou

Bert Vangilbergen

Laurent Hermans

Frans Nijs

Jimmy Vermeulen

John Zabolitsky

Jurgen Everaerts

Kw Cheung

Kc Leung

For three-dimensional topography measurement of a surface of an object patterned illumination is projected on the surface through an objective. A relative movement between the object and the objective is carried out, and plural images of the surface are recorded through the objective by a detector. The direction of the relative movement includes an oblique angle with an optical axis of the objective. Height information for a given position on the surface is derived from a variation of the intensity recorded from the respective position. Also, patterned illumination and uniform illumination may be projected alternatingly on the surface, while images of the surface are recorded during a relative movement of the object and the objective along an optical axis of the objective. Uniform illumination is used for obtaining height information for specular structures on the surface, patterned illumination is used for obtaining height information on other parts of the surface.

Method and system for optical three dimensional topography measurement

The invention relates to an image acquisition system and an image acquisition method, as well as to an inspection system having at least one such image acquisition system. A projector projects a pattern on a surface of a sample, a camera records light intensity information from within at least two detection fields defined by the camera on the surface of the sample. A relative motion between the sample on the one hand and the camera and projector on the other hand is generated. From the acquired at least one image a height profile of the surface of the sample may be inferred. The pattern may comprise a number of sub-patterns related to each other by a phase shift. Alternatively, the pattern may be a fringe pattern.

Image acquisition system, image acquisition method, and inspection system

An apparatus for automatic pitch conversion for pick and place heads, comprising at least one auto pitch station for adjusting a pitch in a X-coordinate direction and/or adjusting a pitch in a Y-coordinate direction of pickers/grippers of a pick and place heads; a first actuator, operated by a motor gear assembly of the at least one auto pitch station, wherein the first actuator changes the pitch in the X-coordinate direction distance between rows of pickers/grippers of the respective pick and place head; and a second actuator operated by the same motor gear assembly, wherein the second actuator changes the pitch in the Y-coordinate direction between the pickers/grippers within a row of the respective pick and place head. A method for automatic pitch conversion of pick and place heads and a pick and place head and a pick and place device.

Apparatus and method for automatic pitch conversion of pick and place heads, pick and place head and pick and place device

An apparatus () and a method for the three dimensional inspection of saw marks () on at least one surface () of a wafer () are disclosed. At least one camera () is required to capture an image of the entire surface () of the wafer (). At least one line projector () provides a light bundle (), centered about a central beam axis (). The line projector () is arranged such that the central beam axis () is at an acute angle (&#x3b1;) with regard to the plane (P) of the wafer (). A line shifter () is positioned in the light bundle () between each line projector () and the surface () of the wafer (). A frame grabber () and an image processor () are used to synchronize and coordinate the image capture and the position of the pattern () of lines () on the front side (F) and/or the back side (B) of the wafer ().

Apparatus and method for three dimensional inspection of wafer saw marks

A method and an apparatus for measuring respective positions of a set of N contact elements of an electronic component. A first and a second light path are created by a first and a second light beam which have different viewing angles. Both the first and the second light path can selectively be opened and both end into the image plane of a single camera. The positions being determined by using the first and second image produced by the first and second light beam respectively.

Method and an apparatus for measuring positions of contact elements of an electronic component

A method and an apparatus for measuring respective positions of a set of contact elements of an electronic component, wherein the contact elements are illuminated with a light source producing a light with an incident angle of at the most 20&deg; and wherein a first respectively a second image is recorded of said elements by means of a first respectively a second camera which are set up over a triangulation angle with respect to each other.

Measuring positions of coplanarity of contract elements of an electronic component with a flat illumination and two cameras

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Blanden, Belgium

Karel Van Gils