Seagate Technology Incorporated

Kara L Maytag

Leping Li

Joel William Hoehn

Roger L Hipwell

Jeff O'Konski

Mark Allen Herendeen

John L Ibele

Pramit P Parikh

Sarah R Marotz

Saravuth Keo

Edward Alan Knutson

Joe J Schobel

Ralph Marquart

A device and system for precise measurement of a thickness and determination of a profile of a slider row bar. The device includes a bar mount fixture having a structure for supporting the row bar by an edge, a first probe and a second probe on either side of the row bar, each probe being a non-contact sensor with a measurement precision of 0.5 micrometer, with each of the probes laterally moveable in relation to the bar mount fixture. Also included are methods of using a device for precisely measuring of a thickness and determining of a profile of a slider row bar.

Row bar thickness measurement device, system and methods

The presently disclosed technology describes systems and methods for attaining a ball bond using less than 1 thousandth of an inch diameter gold wire using ultrasonic bonding energy and without heating an underlying bonding pad. The ball bond allows the use of particularly small bonding pads that are particularly close to adjacent microelectronic structures that limit the use of other bonding techniques that have shallow take-off angles.

Ambient temperature ball bond

Growing community of inventors

Plymouth, MN, United States of America

Kara L Maytag