Hon Hai Precision Industry Co., Ltd.

Fu Tai Hua Industry (shenzhen) Co., Ltd.

Fulian Yuzhan Precision Technology Co., Ltd

Kar-Wai Hon

Shyan-Juh Liu

Sha-Sha Liu

Hao Zhou

Dong-Xu Zhang

Ching-Hao Yang

Li-Ming Shen

An-Li Qin

Yu-mei Hu

Shi-chu Xue

Zheng-quan Wang

Zhong-hua Mai

Qing-rui Wang

A metal product includes a metal substrate, at least one first hole, at least one second hole, and at least one third hole. The first hole is formed in a surface of the metal substrate. The second hole is formed in at least one of a portion of the surface of the metal substrate without the first hole and an inner surface defining the first hole. The third hole is formed in at least one of a portion of the surface of the metal substrate without the first hole and without the second hole, a portion of the inner surface defining the first hole without the second hole, and an inner surface defining the second hole. The first, second, and third holes enhance a bonding strength between the metal product and a material product. The disclosure also provides a metal composite and a method for manufacturing the metal product.

Metal product, method for manufacturing the metal product, and metal composite

A metal article comprises two metals, and a first hole and an oxide layer are set correspondingly on the surfaces of the two metals. To avoid the electrolytic corrosion on the interface between the two metals during the formation of the first hole, the disclosure provides a method of manufacturing the metal article. By putting a metal substrate in a first electrolyte including an etching agent and a passivating agent and applying electricity on the metal substrate, the metal article with the first hole is formed without electrolytic corrosion. The disclosure also provides a metal composite, which is formed by setting a material part in the first hole of the metal article.

Metal article, method for manufacturing the metal article, and metal composite

A method for manufacturing a housing of an electronic device includes the following steps. An area not to be etched is shielded and an etching area is exposed. The etching area is etched by photolithography and forming a plurality of heat dissipation holes of nanometer scale in the etching area. The area not to be etched is cleaned for removing the shielding.

Method for manufacturing housing

A composite of metal and resin and a manufacturing method require a metal piece and a resin piece, and the surface of the metal piece is etched to include a number of micropores. Each micropore includes a first inclined hole and a second inclined hole, the first inclined hole and the second inclined hole diverging from each other below the surface of the metal piece. The first inclined hole and the second inclined hole extend downwards from a common starting hole which is symmetric around an axis perpendicular to the surface of the metal piece. The resin is embedded in the micropores to combine with the metal piece, where the bonding strength of the composite of metal and resin is increased.

Composite of metal and resin

A method for manufacturing composite of resin and other materials includes the following steps. A shaped piece made by materials different with resin is provided, and is degreased and cleaned. A resist layer with a lot of location holes is formed on the surface of the heterogeneous member by nano-imprint lithography, and a lot of small holes are formed on the surface of the heterogeneous member while the resist layer is removed. Then the heterogeneous member is inserted in an injection mold, and molten crystalline thermoplastic resin is injected into the mold, thus the resin embedded into the holes and bonding with the shaped piece. The method is environmentally friendly and suitable for mass production.

Composite of resin and other materials and method for manufacturing the same

A composite of metal and resin is provided. The composite of metal and resin includes a metal piece and a resin piece, and the surface of the metal piece includes a number of micropores. Each micropore includes a first inclining hole and a second inclining hole, and the first inclining hole and the second inclining hole are disposed inclined with the surface of the metal piece. The first inclining hole and the second inclining hole are disposed symmetrical around an axis perpendicular to the surface of the metal piece, and communicate with each other on the surface of the metal piece. The resin piece is embedded to the micropores to combine with the metal piece. The bonding strength of the composite of metal and resin is increased. A method of manufacturing the composite of metal and resin is also provided.

Composite of metal and resin and method for manufacturing same

An electronic device includes a housing, a mother board received in the housing, and a plurality of heat-generating members received in the housing. A dissipation area is formed in the housing, and a plurality of dissipation holes are defined in an outer surface of the dissipation area. Each dissipation hole is in a nanometer scale. The disclosure also supplies a method for manufacturing a housing of the electronic device.

Growing community of inventors

Taipei, Taiwan

Kar-Wai Hon